Electrical and mechanical studies of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb lead free soldering materials

• Autorzy: Kisiel R. , Gąsior W. , Moser Z. , Pstruś J. , Bukat K. , Sitek J.

Warianty tytułu

PL

Badania właściwości elektrycznych i mechanicznych lutowi bezołowiowych Sn-Ag-Cu-Bi i Sn-Ag-Cu-Bi-Sb

• Języki publikacji: EN

Abstrakty

EN

The electrical resistivity and the tensile strength of two near ternary eutectic Sn-Ag-Cu and four solder alloys close to ternary eutectic Sn-Ag-Cu with different Bi content as well as eight Sn- Ag-Cu-Bi with different Sb content in the form of wires were investigated. The four-probe technique was used for electrical parameters measurements. Equipment of the author’s own construction for the tensile strength measurement was applied. It was found that the additions of Bi and Sb to Sn-Ag-Cu near eutectic alloys increase the resistivity and the tensile strength and that the reistivity of the Sn-Ag-Cu-Bi and Sn-Ag-Cu-Bi-Sb alloys is comparable with those of Pb-Sn solders for the bismuth and antimony content of about 3 atomic percent.

Słowa kluczowe

EN

Sn-Ag-Cu; Sn-Ag-Cu-Bi; lead-free solder

PL

Sn-Ag-Cu; Sn-Ag-Cu-Bi; lut bezołowiowy

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2005
• Tom: Vol. 50, iss. 4
• Strony: 1065--1071
• Opis fizyczny: Bibliogr. 4 poz., rys.

Twórcy

autor

Kisiel R.

• Institute of Microelectronics and Optoelectronics, Politechnika Warszawska, 00-662 Warszawa, ul. Koszykowa 75

autor

Gąsior W.

• Instytut Metalurgii i Inżynierii Materiałowej, PAN, 30-059 Kraków, ul. Reymonta 25

autor

Moser Z.

• Instytut Metalurgii i Inżynierii Materiałowej, PAN, 30-059 Kraków, ul. Reymonta 25

autor

Pstruś J.

• Instytut Metalurgii i Inżynierii Materiałowej, 30-059 Kraków, ul. Reymonta 25

autor

Bukat K.

• Tele and Radio Research Institute, 03-450 Warszawa, ul. Ratuszowa 11

autor

Sitek J.

• Tele and Radio Research Institute, 03-450 Warszawa, ul. Ratuszowa 11

Bibliografia

• [1] R. Kisiel, W. Gąsior, Z. Moser, J. Pstruś, K. Bukat, J. Sitek, (Sn-Ag)eut + Cu Soldering Materials, Part II: Electrical and Mechanical Studies Journal of Phase EquUibria and Diffusion 25 2, 122-4 (2004).
• [2] J. S. Hwang, Environment-Friendly Electronics: Lead-Free Technology, Electrochemical Publications Ltd, 2001, Chapter 10, 252-265 (2001).
• [3] National Institute of Standards and Technology & Colorado School of Mines, Database for Solder Properties with Emphasis on New Lead-Free Solders, Colorado, February 11, 2002.
• [4] B. A. Cook, I. E. Anderson, J. L. Harringa, R. L. Terpstra, J. Electronic Materials 31, 1190-1194 (2002).