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Due to the fast advancement of manufacturing technologies for micro- and nanostructured components and the increasing need for sophisticated inspection methods the paper discusses the prerequisites for automatic execution of inspection plans [1]. Based on the latest state-of-the-art, the setup and operating principle of a closed quality loop for dimensional inspections is described. The ongoing development of manufacturing technologies and the increasing complexity of specimen to be inspected require more than one sensor to perform dimensional measurements efficiently. The I++ DME (Dimensional Measurement Equipment) interface standard enables the interoperability of different measurement software with different coordinate measuring machines (CMM). A novel concept to integrate multiple sensors at one CMM via I++ DME rather than via proprietary interfaces is presented. The outlined novel concept is based on an I++ DME node.
Czasopismo
Rocznik
Tom
Strony
71--87
Opis fizyczny
Bibliogr. 30 poz., fot., rys., tab.
Twórcy
autor
autor
autor
autor
autor
- Technische Universität Ilmenau, Department of Quality Assurance, Germany, susanne.toepfer@tu-ilmenau.de
Bibliografia
- 1. Weck M.: Proc./Int. Seminar on Precision Engineering and Micro Technology. Verlag Rhiem, 2000.
- 2. Hesselbach J., Raatz A. (eds.): MikroPRO – Untersuchung zum internationalen Stand der Mikroproduktionstechnik. Essen, Vulkan-Verlag, 2002.
- 3. Blunt L., Jiang X., Scott P., Xiao S.: Surface Metrology of MST Devices. Proc. of XI. Int. Colloquium on Surfaces, Chemnitz, Germany, vol. 1, pp. 22-32, 2004.
- 4. ZVEI: Erfolgsfaktoren für eine industrielle Mikrosystemtechnik in Deutschland - Positionspapier Juni 2002. http://www.zvei-be.org, 25.02.2005.
- 5. VDI/VDE-IT: Verbundfaltblatt Mikrosystemtechnik - Prüf- und Qualitätssicherungssystem für die industrielle Fertigung von wafergebondeten Mikrosystemen 2002-2006. http://www.bmbf.de, 22.02.2005.
- 6. Sandmaier H., Nommensen P., Frech J.: Prozessbegleitende Messtechnik und Endprüfung in der Mikrosystemtechnik. VDI Bericht Metrologie in der Mikro- und Nanotechnik, no. 1669, pp. 85-94, 2003.
- 7. Fraunhofer IWM: Enorme Kostensenkung für mikrosystemtechnische Produkte. http://www.innovationsreport.de/html/berichte/energie_elektrotechnik/bericht-37920.html, 4.4.2005.
- 8. Becker G., Pfeifle J.: I++ DME Goals and Objectives. Presentation at IA.CMM User Conference, Sinsheim, 8th May 2003.
- 9. Horst J., AIAG MIPT and NIST: Addressing the challenge of dimensional metrology system interoperability. Presentation held at Annual Symposium of National Conference of Standard Laboratories (NCSL) International, San Diego, USA, 7th August 2002.
- 10. VDI, VDE, DGQ: Prüfplanung Richtlinie 2619. Verein Deutscher Ingenieure, June 1985.
- 11. Storz G.: Automatisierte Vermessung von Mikrokomponenten. In: Forschungsberichte RPK der Universität Karlsruhe. Band 4, Aachen: Shaker Verlag, 2001.
- 12. Wilkening G.: Methoden der Oberflächenmesstechnik. VDI Bericht, no. 1669, pp. 21-29, 2003.
- 13. ITRS: http://public.irts.net.
- 14. Weckenmann A., Ernst R.: Metrologie in der Mikro- und Nanotechnik, VDI Bericht, no. 1669, pp. 1-11, 2003.
- 15. Machleidt T., Franke K. H.: Reconstruction of measurements with scanning force microscopes with special image processing algorithms. Proc. of XI. Int. Colloquium, Chemnitz, Germany, vol. 1, pp. 268-273, 2004.
- 16. Surface/Interface Inc.: Stylus NanoProfilometer (SNP) – Tip Characterization, 23.07.2004. http://www.d2m.com/SIIWEBNEW/snpkeytip.html.
- 17. Frase C. G., Bodermann B., Häßler-Grohne W., Czerkas S., Mirande W., Bosse H.: Metrologische Charakterisierung von neu entwickelten Photomasken-Strukturbreiten-Normalen. PTB-Mitteilungen, vol. 114, no. 1, pp. 36-43, 2004.
- 18. Bader F., Roth R., Seitz K.: Aspekte zum dimensionellen Messen von mikromechanischen Bauteilen. VDI Bericht, no. 1669, pp. 109-116, 2003.
- 19. Brauchle R.: WEPROM – Der Schlüssel für die automatisierte Prozesskette von der Produktentwicklung bis zur Prüfung. BMBF Abschlussbericht, 2002.
- 20. Linß G., Töpfer S., Nehse U.: Hard- and Software Interfaces Enabling Efficient Inspection Planning at the Nano Positioning and Nano Measuring Machine. 10th IMEKO TC7 Symp., Russia, vol. 2, pp. 376-381, 2004.
- 21. Jäger G., Grünwald R., Manske E., Hausotte T., Füßl R.: A Nanopositioning and Nanomeasuring Machine: Operation-Measured Results. Nanotechnology and Precision Engineering, vol. 2, no. 2, pp. 81-84, 2004.
- 22. I++ Working Group: I++DME Interface – Release 1.5., http://www.iacmm.org, 2005.
- 23. Keferstein C. P., Züst R.: Minimizing technical and financial risk when integrating and applying optical sensors for in-process measurement. IMS Int. Forum, ISBN 88-901168-9-7, part 1, pp. 475-482, 2004.
- 24. OSIS Working Group: Optical Sensor Interface Standard V 1.0. http://www.ntb.ch/pub/bscw.cgi/d18647/OSIS_WG2_Standard_Documentation.pdf, 01.06.2005.
- 25. AS ISO 22093-2004: Industrial automation systems and integration - Physical device control – Dimensional Measuring Interface Standard (DMIS). 2004.
- 26. Kramer T., Horst J.: A Comparison of the CMM-driver Specification Release #1.9 with the I++ DMEInterface Release 0.9. NIST Report, no. 6863, 2002.
- 27. VDI/VDE/IT: Projekt: 3D-Mikromesstechnik - 3DMikro. http://www.mstonline.de/foerderung/projektliste/detail_html?vb_nr=V3MPT017, 01.06.2005.
- 28. Peterson L.L., Davie B. S.: Computer Networks – A Systems Approach. 3rd ed. Morgan Kaufmann Publishers Inc, US, San Francisco, 2003.
- 29. Hunt C.: TCP/IP Network Administration. 2nd ed., Sebastopol, CA: O'reilly, 1997, ch. 4.2.1.
- 30. Töpfer S., Linß G., Nehse U.: Inspection Strategies and Inspection Planning for Dimensional Measurements of Micro- and Nanostructured Components Using A Cascaded Sensor System. Proc. of Joint Int. IMEKO TC1+TC7 Symposium, Ilmenau, Germany, Sept. 2005.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BSW1-0028-0006