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Tytuł artykułu

Thermal stability of functional properties in dispersion and precipitation hardened selected copper alloys

Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Języki publikacji
PL
Abstrakty
EN
Purpose: The objective of the study was to produce copper-based dispersion hardened materials of submicron grain size, determination of their basic functional properties and stability in high temperature, as well as comparison of those properties with properties of selected precipitation hardened copper alloys made by classical method of melting, casting and thermomechanical processing. Design/methodology/approach: The examination was conducted on copper hardened with WC, Y2O3 and Cr3Si particles and on precipitation hardened copper alloys with addition of Cr and Ni, Si, Cr. The examination of the materials covered changes in hardness, electrical conductivity and stabilities of those properties after various heat treatment options. Findings: Assuming the tendency to softening depending on annealing temperature to be as a criterion of properties stability, temperature ranges of individual alloys applications were determined Research limitations/implications: The study could be supplemented with information on tendencies to high-temperature creep in the examined alloys Practical implications: The materials are used for components operating in high-temperature conditions, such as components of crystallizers for continuous casting of metals, electrodes for welding, in nu clear reactors, etc. Originality/value: The originality lies in examination of dispersion hardened materials (especially Cu – Cr3Si) of controlled submicrometric structure obtained from initial nanocrystalline structure.
Rocznik
Strony
17--20
Opis fizyczny
Bibliogr. 15 poz.
Twórcy
autor
autor
  • Division of, Materials Processing Technology, Management and Computer Techniques in Materials Science, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18a, 44-100 Gliwice, Poland, jerzys@imn.gliwice.pl
Bibliografia
  • [1] D.Y. Ying, D.L. Zhang, D.Y, D.L (2000), Processing of Cu- Al2O3 metal matrix nanocomposite materials by using high strengthened – conductivity copper alloys containing ZrC ceramics, Composites A38 (2007) 272-279.
  • [2] M. Lopez, J.A. Jimenez, D. Corredor, Precipitation strengthened – conductivity copper alloys containing ZrC ceramics, Composites A38 (2007) 272-279.
  • [3] D.W. Lee, O. Tolochko, C.J. Choi, B.K. Kim, Aluminium oxide dispersion strengthened copper produced by thermomechanical process, Powder Metallurgy 45 (2002) 267-270.
  • [4] M. Motta, P.K. Jena, E.A. Brocchi, I.G. Solorzano, Characterization of Cu-Al2O3 nano scaled composites synthesized by in situ reduction, Materials Science and Engineering C15 (2001) 175-177.
  • [5] N. Wang, Effect of grain size on mechanical properties of nanocrystalline materials, Acta Metalurgica Materialia 2c (1995) 519-528.
  • [6] Y.J. Li, X.H. Zeng, W. Blum, Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu, Acta Materialia 52 (2004) 5009-5018.
  • [7] R. Suryanarayanan, Plastic deformation of nanocrystalline Cu and Cu-0,2 wt.% B, Materials Science and Engineering A264 (1999) 210-214.
  • [8] H. Conrad, Grain size dependence of the plastic deformation kinetics in Cu, Materials Science and Engineering A341 (2003) 216-228.
  • [9] K.S. Kumar, H. Van Swygenhoven, S. Suresh, Mechanical behaviour of nanocrystalline metals and alloys, Acta Materialia 51 (2003) 5743-5774.
  • [10] D.V. Kudashov, Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling, Materials Science and Engineering A387-379 (2004) 768-771.
  • [11] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Proceedings of the 11th International Scientific Conference “Contem-porary Achievements in Mechanics, Manufacturing and Materials Science”,CAM3S’2005, Gliwice – Zakopane, 2005, (CD-ROM).
  • [12] J. Stobrawa, Z. Rdzawski, Deformation behaviour of dispersion hardened nanocrystalline copper, Journal of Achievements in Materials and Manufacturing Engineering 17 (2006) 153-156.
  • [13] J.P. Stobrawa, Z.M. Rdzawski, W.J. G uchowski, Micro-structure and properties of nanocrystalline copper- yttria microcomposites, Journal of Achievements in Materials and Manufacturing Engineering 24/2 (2007) 83-86.
  • [14] J.P. Stobrawa, Z.M. Rdzawski, W.J. Głuchowski, Microstructure and properties of dispersion hardened submicron grained copper, Journal of Achievements in Materials and Manufacturing Engineering 20 (2007) 195-198.
  • [15] J.P. Stobrawa, Z.M. Rdzawski, Dispersion–strengthened nano-crystalline copper, Journal of Achievements in Materials and Manufacturing Engineering 24/2 (2007) 35-42.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BSL9-0031-0016
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