Microstructural and thermal analysis of Cu-Ni-Sn-Zn alloys by means of SEM and DSC techniques

• Autorzy: Wnuk G. , Zielińska M.
• Języki publikacji: EN

Abstrakty

EN

Purpose: The urgent need to find new, non toxic, high temperature solders caused the abundance of research on multicomponent systems, so as to find new materials that could substitute lead-containing solders. Design/methodology/approach: In the paper Cu-Ni-Sn-Zn alloys were studied by differential scanning calorymetry (DSC) in argon atmosphere using a heating rate of 10 Kmin-1 and a cooling rate of 15 Kmin-1. There were determined heat effects and start and finish temperature of phase transitions. Each sample was heated and cooled twice. At the second run, Zn concentration was smaller (as Zn is a volatile component). Findings: Zn influence on phase transformations was established. For the second run, when Zn activity is smaller, heats and temperature of transformations are higher. Research limitations/implications: These experimental results, combined with other thermodynamic properties of the studied alloy, enable phase diagram calculation in the frame of the COST action MP0602. Practical implications: Phase diagrams of the studied alloys allow finding appropriate solder materials. Originality/value: The paper presents an influence of zinc on temperature and heats of transformations in Cu-Ni-Sn-Zn alloys and the microstructure of these alloys.

Słowa kluczowe

EN

DSC; scanning electron microscopy

PL

DSC; tomograficzna mikroskopia elektronowa

• Wydawca: International OCSCO World Press
• Czasopismo: Archives of Materials Science and Engineering
• Rocznik: 2009
• Tom: Vol. 40, nr 1
• Strony: 27--32
• Opis fizyczny: Bibliogr. 15 poz.

Twórcy

autor

Wnuk G.

autor

Zielińska M.

• Department of Materials Science, Rzeszow University of Technology, Rzeszów, Poland,

Bibliografia

• [1] T. Sasaki, M. Tanaka, Y. Ohno, Intermetallics compound formation between lead-free solders (Sn) and Cu or Ni electrodes, Materials Letters 55/10 (2007) 2093-2095.
• [2] G. Niewielski, D. Kuc, Structure of the copper under controlled deformation path conditions, Archives of Materials Science and Engineering 36/1 (2009) 20-27.
• [3] A. Jansson, Thermodynamic evaluation of Zn-Ni system.TRITA-MAC-0340, Materials Research Centre, Royal Institute of Technology, Stockholm, 1987.
• [4] G.P. Vassilev, T. Gomez-Acebo, J.C. Tedenac, Thermodynamic optimization of the Ni-Zn system, Journal of Phase Equilibria 21 (2000) 287-301.
• [5] I. Ansara, A.T. Dinsdale, M.H. Rand, COST 507-Thermochemical Database for Light Metal Alloys vol. 2, European Communities, Belgium, 1998.
• [6] J. Miettinen, Thermodynamic description of the Cu-Ni-Sn system at the Cu-Ni side, Computer Coupling of Phase Diagrams and Thermochemistry 27 (2003) 263-274.
• [7] C. Chou, S.Chen, Phase equilibria in the Sn-Zn-Cu ternary system, Acta Materialia 54 (2006) 2393-2400.
• [8] J. Miettinen, Thermodynamic description of the Cu-Ni-Sn system at the Cu-Ni side, Computer Coupling of Phase Diagrams and Thermochemistry 27 (2003) 309-318.
• [9] J. Romanowska, G. Wnuk, P. Romanowski, Experimental Study on Thermodynamics of the Cu-Ni-Sn-Zn system, Archives of Metallurgy and Materials 53/4 (2008) 1107-1110.
• [10] U.R. Kattner, C. Handwerker, Calculation of Phase Equilibria in Candidate Solder Alloys, Z. Metalkd. 92/7 (2001) 740-746.
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• [12] W. Zielenkiewicz, Calorymetry, Institute of Physical Chemistry of the Polish Academy of Sciences, 2008.
• [13] M. Zielińska, K. Kubiak, M. Sieniawski, Surface modification, microstructure and mechanical properties of investment cast superalloy, Journal of Achievements in Materials and Manufacturing Engineering 35/1 (2009) 55-62.
• [14] G. Mrówka-Nowotnik, Damage mechanism in AlSi1MgMn alloy, Archives of Materials Science and Engineering 29/2 (2008) 93-96.
• [15] B.H. Kim, J.J. Jeon, K.C. Park, B.G. Park, Y.H. Park, I.M. Park, Microstructural characterization and mechanical properties of Mg-xSn-Al-Zn alloys, Archives of Materials Science and Engineering 30/2 (2008) 93-96.