Thermal-hydraulic performance of a CNT based pin fin heat sink for electronics cooling

• Autorzy: Ismil M. F. , Rashid M. A. I. , Mahbub M.
• Języki publikacji: EN

Abstrakty

EN

This paper describes 3D numerical simulation of the fluid flow and heat transfer characteristics in a pin fin heat sink under constant heat flux condition. Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packaging because of its extraordinarily high thermal conductivity. Fabricated onto a silicon substrate to form micro-channels, the CNT based cooling fins show high heat dissipation efficiency. The simulation is performed for the Reynolds number from 7 to 60 with channel hydraulic diameter 1.22 mm. The results are used to derive the Nusselt number, pressure drop, thermal resistance etc.

Słowa kluczowe

EN

thermal management; CNT; Pin Fin; thermal conductivity; heat dissipation efficiency

PL

przewodność cieplna; wydajność ciepła

• Wydawca: Oficyna Wydawnicza Uniwersytetu Zielonogórskiego
• Czasopismo: International Journal of Applied Mechanics and Engineering
• Rocznik: 2012
• Tom: Vol. 17, no. 4
• Strony: 1149--1162
• Opis fizyczny: Bibliogr. 11 poz., rys., wykr.

Twórcy

autor

Ismil M. F.

autor

Rashid M. A. I.

autor

Mahbub M.

• Department of Mechanical Engineering Bangladesh University of Engineering and Technology, BANGLADESH,

Bibliografia

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