The thickness effects of copper interlayer on frictional properties of lead-tin thin film

• Autorzy: Takeichi Y. , Ariga N. , Li C. S. , Uemura M. , Dzimko M.
• Konferencja: Problems of Non-Conventional Bearing Systems, NCBS '99
• Języki publikacji: EN

Abstrakty

EN

The effects of the thickness of copper interlayer on frictional properties of lead-tin thin films were investigated. Thin film and interlayer were formed by vacuum deposition. The thickness of lead-tin film was about 0.06, 0.09, 0.19 and 0.43 žm. Ball-on-disk type friction test was carried out in vacuum. The load was increased and decreased for the range of about 0.1 to 0.6 N in the "variable load friction test". The thin film with thicker interlayer (~ 30 nm) showed higher friction coefficient as compared to the results for the thin film with thinner interlayer (~ 3 nm). However, abrupt increase in friction coefficient by break down of thin film was not observed for the thin film with thicker interlayer. Moreover, longer endurance life was attained for the thin film with thicker interlayer in the "endurance life friction test". Adhesion of copper to glassy material is greater than that of lead or tin. Also copper would bind tightly with tin by migration. Therefore durability of thin film with thicker copper interlayer would be prolonged although friction coefficients were increased because of the higher shearing strength for copper as compared with that for lead or tin.

Słowa kluczowe

EN

thin film; interlayer; lead; tin; copper

PL

materiałoznawstwo

• Wydawca: Oficyna Wydawnicza Uniwersytetu Zielonogórskiego
• Czasopismo: Applied Mechanics and Engineering
• Rocznik: 1999
• Tom: Vol. 4, no spec.
• Strony: 189--194
• Opis fizyczny: Bibliogr. 7 poz., rys., wykr.

Twórcy

autor

Takeichi Y.

autor

Ariga N.

autor

Li C. S.

autor

Uemura M.

autor

Dzimko M.

• Technology Development Center, Toyohashi University of Technology, Hibarigaoka 1-1, Tempaku, Toyohashi, 441-8580 JAPAN