The influence of barium titanate bati03 as a filler in impregnating epoxy resin on chosen electrical parameters of obtained material.

• Autorzy: Kasprzak W. , Nadolny Z. , Walczak K. , Siodła K. , Sikorski W. , Józwiak K. , Paścik G. , Moron L.
• Konferencja: APTADM 2007, III International Conference on Advances in Processing Testing and Application of Dielectric Materials., September, 26-28, 2007 Wrocław, Poland
• Języki publikacji: EN

Abstrakty

EN

The paper describes the influence of barium titanate BaTiO3 used as a filler in impregnating epoxy resin on electrical parameters of obtained material. The results of computer simulation of electric filed intensity distribution in area of 220 kV AC composite insulator show, that in order to reduce the maximal value of this field it is necessary to use the rod with the highest possible permittivity. It was assumed that the increase of rod permittivity is possible by doping the epoxy resin, being one of glass-epoxy rod components, with a filler having high permittivity value. Barium titanate BaTi03 in micro- and nanograms was chosen as the filler. Presumably, such a change in material structure, may negatively influence other electrical parameters of obtained material, important in composite insulators construction. In order to check the filler dispersion in epoxy matrix, microscopical observations of obtained materials fractions were performed. In wide range of frequency, the permittivity and volume resistivity of obtained materials in were determined. The inception voltage of partial discharges on surface of materials was determined with electric, acoustic and antenna methods.

Słowa kluczowe

EN

nanofillers; BaTiO3; epoxy resin; permittivity increase

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Prace Naukowe Instytutu Podstaw Elektrotechniki i Elektrotechnologii Politechniki Wrocławskiej. Konferencje
• Rocznik: 2007
• Tom: Vol. 46, nr 19
• Strony: 165--170
• Opis fizyczny: Bibliogr. 14 poz.

Twórcy

autor

Kasprzak W.

autor

Nadolny Z.

autor

Walczak K.

autor

Siodła K.

autor

Sikorski W.

autor

Józwiak K.

autor

Paścik G.

autor

Moron L.

• Poznan University of Technology

Bibliografia

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