Effect of Ni addition on the microstructures of melt-spun CuCr ribbons

• Autorzy: Yu M. , Wang Y. , Wang Y. , Sun Z.
• Języki publikacji: EN

Abstrakty

EN

The microstructures and resistivities of melt-spun Cu75Cr25 and Cu(75.x)Cr25Nix (x = 1 or 3 wt. %) ribbons were studied. The size of the Cr-rich phase from liquid phase separation in the Cu75Cr25 microstructure can be decreased from the micrometer-scale to about 250 nm by using melt spinning. After annealing at 600 ° C for 3 h, the resistivity of Cu75Cr25 ribbon can meet the needs of contact. On the melt-spun base, alloying by Ni could further decrease the size of the Cr-rich phase from 250 nm to about 150 nm. However, when the Ni content is higher than or equal to 3%, the resistivity of annealed Cu75. xCr25Nix (x ≥ 3) ribbons is too high to be used by the medium-voltage vacuum interrupters. For nanograined CuCr alloys, its lower arc chopping current is advantageous to the use of contact and the circuitry protect, its long arc trace route and high velocity of spot direction motion could mitigate the partial ablate of cathode surface and the lifetime of contact could be prolonged.

Słowa kluczowe

EN

microstructure; CuCr alloys; contact; melt spinning; resistivity

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2008
• Tom: Vol. 26, No. 3
• Strony: 675--680
• Opis fizyczny: Bibliogr. 16 poz.

Twórcy

autor

Yu M.

autor

Wang Y.

autor

Wang Y.

autor

Sun Z.

• Institute of Materials Science and Technology, Taiyuan University of Science and Technology, Taiyuan 030024. P. R. China,

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