Influence of thermo-mechanical properties of polymer matrices on the thermal conductivity of adhesives for microelectronic packaging

• Autorzy: Felba J. , Fałat T. , Wymysłowski A.
• Języki publikacji: EN

Abstrakty

EN

Thermally conductive adhesives are among major concerns of contemporary microelectronics. The main goal of ongoing research is to improve the thermal conductivity of these composites by using a proper filler material and the best shape and size of filler particles. In this work, it has been proven by numerical simulation that the polymer matrix may also play a crucial role, as the contact area between filler particles depends on the stresses that occur due to the shrinkage of the resin during curing. It has been observed that the resins relax with time. The time until the fully relaxed state is reached strongly depends on the temperature at which the system operates. In the considered case, the contact pressure is fully relaxed when it decreases from the initial value of 0.73 GPa to 0.03 GPa. When the temperature is 70°C, the contact pressure becomes fully relaxed after 10 seconds, but when it is lower than 40°C, the relaxation is completed after about 109 seconds (more than 30 years!). After the relaxation of contact pressure the thermal conductivity drops by approximately 50% of the initial thermal conductivity of the non-relaxed structure.

Słowa kluczowe

EN

thermal conductivity; thermally conductive adhesives; polymer matrix; microelectronic packaging

PL

przewodność cieplna; matryca polimerowa; pakiety mikroelektroniczne

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2007
• Tom: Vol. 25, No. 1
• Strony: 45--55
• Opis fizyczny: Bibliogr. 10 poz.

Twórcy

autor

Felba J.

autor

Fałat T.

autor

Wymysłowski A.

• Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, ul. Janiszewskiego 11/17, 50-372 Wroclaw,

Bibliografia

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