Diffusion Bonding of Electroless Ni plated WC composite to Cu and AISI 316 Stainless Steel

• Autorzy: Yonetken A. , Cakmakkaya M. , Erol A. , Talas S.
• Języki publikacji: EN

Abstrakty

EN

In this study, a composite containing WC (Tungsten Carbide) and Ni was produced by two different processing routes. Electroless Ni coated WC powders were consolidated and sintered at 1200 °C. Diffusion bonding couples of WC(Ni)-electrolytic Cu, WC(Ni)-AISI 316 stainless steel and WC(Ni)-WC(Ni) were manufactured by using a preloaded compression system under Ar atmosphere. Diffusion bonding was carried out at varying bonding temperatures; 750 °C for (WC)Ni-Cu diffusion couple and 1200 °C for (WC)Ni-(WC)Ni and (WC)Ni-AISI 316 stainless steel diffusion couples. Standard metallographic techniques, Scanning Electron Microscopy and a shear test were employed to characterize the microstructure of bondline and mechanical properties of each diffusion couple, respectively.

Słowa kluczowe

EN

ceramic matrix composite; electroless plating; powder metallurgy; diffusion bonding

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2011
• Tom: Vol. 29, No. 1
• Strony: 15--21
• Opis fizyczny: Biblogr. 20 poz.,

Twórcy

autor

Yonetken A.

autor

Cakmakkaya M.

autor

Erol A.

autor

Talas S.

• A. Kocatepe University, Technical Education Faculty, 03200, Afyonkarahisar, Turkey

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