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A study of manufacturing micromirrors inclined at 45° towards silicon substrate has been presented in this paper. The micromirrors can be formed by {100} or {110} sidewall planes etched in (110) or (100) Si substrates in alkaline solutions. The smoothness of the surface and etch rate anisotropy are crucial parameters of fabricated structures. The research focused on Si(100) wafers etched either in KOH solutions with alcohol additives or in low concentrated TMAH solutions with surfactant addition and on Si(110) wafers etched in pure highly concentrated KOH or TMAH solutions. The examination showed difficulty of fabrication of the structures with smooth sidewalls and with appropriate shape simultaneously. At the end of the paper, the structure for bringing close and parallel of two optical beams has been proposed.
Czasopismo
Rocznik
Tom
Strony
423--430
Opis fizyczny
Bibliogr. 4 poz.
Bibliografia
- [1] RESNIK D., VRTACNIK D., ALJANCIC U., MOZEK M., AMON S., The role of Triton surfactant in anisotropic etching of {110} reflective planes on (100) silicon, Journal of Micromechanics and Microengineering 15(6), 2005, pp. 1174–1183.
- [2] ZUBEL I., KRAMKOWSKA M., Silicon microstructure for bringing closer parallel beams of laser diodes, Procedia Chemistry 1(1), 2009, pp. 437–440.
- [3] ZUBEL I., Silicon anisotropic etching in alkaline solutions III: On the possibility of spatial structures forming in the course of Si(100) anisotropic etching in KOH and KOH +IPA solutions, Sensors and Actuators A 84(1–2), 2000, pp. 116–125.
- [4] YI WEI XU, MICHAEL A., CHEE YEE KWOK, GANG DING PENG, A novel technique of fabricating rear 45° micromirror for stacked die optical interconnect, Procedia Chemistry 1(1), 2009, pp. 1167–1170
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BPW7-0017-0019