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This study investigates the reliability physics of the reverse bias luminescence (RBL) of InGaN/GaN light emitting diodes. Optical and electrical characterization techniques including surface temperature measurements, 2D X-ray fluorescent element analysis, and 2D electroluminescence (EL) measurements reveal the leakage current distribution and the origin of the reverse bias leakage current. Using these techniques, this study examines the electroluminescence behavior and surface temperature distribution in forward bias and reverse bias conditions. Results show that the reverse bias EL originates from hot electron-induced emission, which in turn is due to the leakage current in the high electric field region caused by metal contact abnormalities. The optical and electrical characterization techniques adopted in this study are a promising screening tool for correlating device failures with fabrication processes.
Słowa kluczowe
Czasopismo
Rocznik
Tom
Strony
195--205
Opis fizyczny
Bibliogr. 11 poz.
Twórcy
autor
autor
autor
autor
- Department of Applied Materials and Optoelectronic Engineering, National Chi Nan University, Puli, Taiwan, R.O.C.
Bibliografia
- [1] CAO X.A., TEETSOVA J.A., SHAHEDIPOUR-SANDVIK F., ARTHUR S.D., Microstructural origin of leakage current in GaN/InGaN light-emitting diodes, Journal of Crystal Growth 264 (1–3), 2004,pp. 172–177.
- [2] SUN Y., YU T., ZHAO H., SHAN X., ZHANG X., CHEN Z., KANG X., YU D., ZHANG G., Microanalyses of the reverse bias leakage current increase in the laser lift off GaN-based light emitting diodes,Journal of Applied Physics 106 (1), 2009, p. 013101.
- [3] CHEN H., Exploration of the Potential Defects in GaN HEMTs, Verlag Dr. Müller, Saarbrücken,Germany, 2009.
- [4] KAO C.H., CHEN H., CHIU J.S., CHEN K.S., PAN Y.T., Physical and electrical characteristics of the high-k Ta2O5 (tantalum pentoxide) dielectric deposited on the polycrystalline silicon, Applied Physics Letters 96 (11), 2010, p. 112901.
- [5] CHEN H., PREECHA P., LAI Z., LI G.P., Investigation of anomaly in GaN HEMTs, Journal of the Electrochemical Society 155 (9), 2008, pp. H648–H652.
- [6] CHEN N.C., WANG Y.N., WANG Y.S., LIEN W.C., CHEN Y.C., Damage of light-emitting diodes induced by high reverse bias stress, Journal of Crystal Growth 311 (3), 2009, pp. 994–997.
- [7] KIKAWA J., YOSHIDA S., ITOH Y., Electroluminescence studies under forward and reverse bias conditions of nitride-rich GaN1–xPx SQW structure LED grown by laser-assisted metal-organic chemical vapor deposition, Solid-State Electronics 47 (3), 2003, pp. 523–527.Optical and electrical characterization of reverse bias luminescence... 205
- [8] CHEN H., LAI Z., KUNG S.C., PENNER R.M., CHOU Y.C., LAI R., WOJTOWICZ M., LI G.P., Observing electroluminescence from yellow luminescence-like defects in GaN high electron mobility transistors, Japanese Journal of Applied Physics 47 (5), 2008, pp. 3336–3339.
- [9] TAM S., KO P.K., HU C., Lucky-electron model of channel hot-electron injection in MOSFET’S,IEEE Transactions on Electron Devices 31 (9), 1984, pp. 1116–1125.
- [10] HUI K., HU C., GEORGE P., KO P.K., Impact ionization in GaAs MESFETs, IEEE Electron Device Letters 11 (3), 1990, pp. 113–115.
- [11] HSU C.Y., LAN W.H., WU Y.S., Effect of thermal annealing of Ni/Au ohmic contact on the leakage current of GaN based light emitting diodes, Applied Physics Letters 83 (12), 2003, pp. 2447–2449.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BPW7-0016-0018