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One of the major topics in novel microelectronics are thin film materials - especially their mechanical properties. Accurate description of such materials is necessary in order to assess their reliability and to predict failures in electronic devices. The mechanical attributes of thin films can be determined using the nanoindentation test. However, with this equipment it is only possible to obtain estimates elastic parameters: Young´s modulus and hardness of the thin layer. In the paper, it is demonstrated that with a support of numerical methods the plastic behaviour of the material can also be extracted. The numerical FEM model of the nanoindentation test was elaborated and numerical optimization algorithms were applied. The goal was to examine the elastoplastic behaviour of the investigated thin film, which is the aluminium layer in this case. Various numerical material models were used in order to decently extract the material properties of the investigated thin layer.
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Tom
Strony
655--662
Opis fizyczny
Bibliogr. 7 poz.
Twórcy
autor
autor
autor
autor
autor
- Wrocław University of Technology Faculty of Microsystem Electronics and Photonics ul. Janiszewskiego 11/17 50-372 Wrocław Poland
Bibliografia
- [1] OLIVER W.C., PHARR G.M., J. Mater. Res., 7 (1999), 12564.
- [2] VENKATESH T.A., VAN VLIET K.J., GIANNAKOPOULOS A.E., SURESH S., Scripta Mater., 42 (2000), 833.
- [3] FISCHER-CRIPPS A.C., Nanoindentation, Springer, New York, 2004.
- [4] GIANNAKOPOULOS A.E., SURESH S., Scripta Mater., 40 (1999), 1191.
- [5] DOERNER M.F., J. Mater. Res., 1 (1986), 601.
- [6] XIAODONG L., BHARAT B., Mater. Charact., 42 (2002), 11.
- [7] WYMYSŁOWSKI A., WITTLER O., MROSSKO R., DUDEK R., Application of nanoindentation technique in microelectronics, Int. Conf. IMAPS – CPMT, IEEE Poland, 2008.
Typ dokumentu
Bibliografia
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bwmeta1.element.baztech-article-BPW7-0014-0053