Stress modification in gold metal thin films during thermal annealing

• Autorzy: Prószyński A. , Chocyk D. , Gładyszewski G.
• Języki publikacji: EN

Abstrakty

EN

Stress evolution during deposition of 50 nm Au thin films by thermal evaporation in a UHV system and then stress modification during thermal vacuum annealing have been performed. For stress measurement a substrate curvature approach has been applied. The changes in stress versus temperature linked to a modification of microstructure has been interpreted. To obtain any information about structural changes in the film X-ray diffraction measurements has been performed. We can conclude from the measurements that during the first cycle some irreversible structural modifications occur in a metal film.

Słowa kluczowe

EN

thin films; annealing; strain; stress

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Optica Applicata
• Rocznik: 2009
• Tom: Vol. 39, nr 4
• Strony: 705--710
• Opis fizyczny: bibliogr. 14 poz.,

Twórcy

autor

Prószyński A.

autor

Chocyk D.

autor

Gładyszewski G.

• Advanced Materials Engineering Research Group, Department of Applied Physics, Lublin University of Technology, Nadbystrzycka 38, 20-618 Lublin, Poland

Bibliografia

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