High temperature LTCC package for SiC-based gas sensor

• Autorzy: Nowak D. , Kulczak D. , Januszkiewicz M. , Dziedzic A.
• Języki publikacji: EN

Abstrakty

EN

A rapid progress in the development of semiconductor microelectronics is still observed. Miniaturization process of electronic devices is closely connected to packaging issues. In many cases package is as important as the device itself. Low temperature co-fired ceramics (LTCC) and thick-film technologies have the potential of incorporating multilayer structures and permit fabrication of special packaging systems. LTCC technology allows us to connect simply electrical or optical signals and to integrate passive components, heaters, sensors, converters, etc. In this paper, an LTCC package for SiC-based hydrogen gas sensor is presented. Some simulations of thermal properties were carried out and package structures were made and investigated. The package protects the sensor against mechanical damage and makes an easy connection of electrical signals possible. Moreover, the heater and temperature sensors allow proper temperature of an element to be obtained. Basic electrical parameters of an integrated heater as well as measured temperature distribution are presented.

Słowa kluczowe

EN

thick-film; low temperature co-fired ceramics (LTCC); packaging

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Optica Applicata
• Rocznik: 2009
• Tom: Vol. 39, nr 4
• Strony: 701--704
• Opis fizyczny: bibliogr. 8 poz.,

Twórcy

autor

Nowak D.

autor

Kulczak D.

autor

Januszkiewicz M.

autor

Dziedzic A.

• Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland

Bibliografia

• [1] GOLONKA L.J., Applications of LTCC Ceramics in Microelectronics, Oficyna Wydawnicza Politechniki Wroclawskiej, Wrocław, 2001 (in Polish).
• [2] GOLONKA L.J., DZIEDZIC A., DZIUBAN J., KITA J., ZAWADA T., LTCC package for MEMS device, Proceedings of SPIE 5124, 2003, pp. 115–119.
• [3] GOLONKA L.J., DZIEDZIC A., KITA J., ZAWADA T., LTCC in microsystems application, Informacije MIDEM 4, 2002, pp. 272–279.
• [4] GOLONKA L.J., New application of LTCC technology, Proceedings of the 28-th International Spring Seminar on Electronics Technology, Wiener Neustadt, Austria, 2005, pp. 148–152.
• [5] MALECHA K., PIJANOWSKA D., GOLONKA L.J., TORBICZ W., LTCC enzymatic microreactor, Journal Microelectronics and Electronic Packaging 4(2), 2007, pp. 51–56.
• [6] SOBOCINSKI M., JUTTI J., JANTUNEN H., GOLONKA L.J., Piezoelectric unimorph valve assembled on an LTCC substrate, Sensors and Actuators A: Physical 149(2), 2009, pp. 315–319.
• [7] MALECHA K., GOLONKA L.J., Microchannel fabrication process in LTCC ceramics, Microelectronics Reliability 48(6), 2008, pp. 866–871.
• [8] CIOSEK P., ZAWADZKI K., STADNIK D., BEMBNOWICZ P., GOLONKA L., WRÓBLEWSKI W., Microelectrode array fabricated in low temperature cofired ceramic (LTCC) technology, Journal of Solid State Electrochemistry 13(1), 2009, pp. 129–135.