Method of assessment of varnishes modified with nanofillers

• Autorzy: Górnicka B. , Górecki L.
• Języki publikacji: EN

Abstrakty

EN

The method of analysis and assessment of the results of investigations of nanofilled varnishes used for electrical insulation have been presented. The proposed method enabled consideration of an effect of the coating thickness. The investigation indicated that improving of the bond strength depends on loading and the size of nanoparticles. The method of fabrication of composites with nanoparticles has an influence on their properties. Composites with fumed silica showed improved dielectric properties. Absorption of water of all formulated varnishes with nanofillers decreases provided that some additives were incorporated.

Słowa kluczowe

EN

impregnating varnish; nanofiller; bond strength; pulse resistance; electrical strength; water; absorption

• Wydawca: De Gruyter
• Czasopismo: Materials Science Poland
• Rocznik: 2009
• Tom: Vol. 27, No. 4/2
• Strony: 1237--1242
• Opis fizyczny: Bibliogr. 6 poz.

Twórcy

autor

Górnicka B.

autor

Górecki L.

• Electrotechnical Institute Division of Electrotechnology and Material Science Wroclaw, Poland

Bibliografia

• [1] FOTHERGILL J.C., DISSADO L.A., Nanocomposite Materials for Dielectric Structures, http://www.le.ac.uk/eg/research/groups/power/highvolt/Nelson/final%20report2.pdf.
• [2] TANAKA T., KOZAKO M., FUSE N., OHKI Y., IEEE Trans. Diel. Electr. Insul., 12 (2005), 669.
• [3] ROY M., NELSON J.K., MACCRONE, L.S. SCHADLER, REED C.W., KEEFE R., ZENGER W., IEEE Trans.Diel. Electr. Insul., 12 (2005), 629.
• [4] TANAKA T., MONTANARI G.C., MÜLHAUPT R., IEEE Trans. Dielectr. Electr. Insul., Vol. 11 (2004), 763.
• [5] NELSON K., UTRACKI L.A., MACCRONE R.K., REED C.W., Role of Interface in Determining the Dielectric Properties of Nanocomposites, http://www.rpi.edu/~nelsoj/ceidp04a.pdf.
• [6] RÄTZKE S., KINDERSBERGER J., Erosion Behaviour of Nano Filled Silicone Elastomers, Proc. XIV Inte. Symp. High Voltage Engineering, Tsinghua University, Beijing, China, August 25–29, 2005, http://www.hsa.ei.tum.de/Publikationen/2005/05_rae_2. pdf.