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Organization of silica spherical particles into different shapes on silicon substrates

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
One of the classes of materials that can be obtained via the sol-gel method are uniform sub-micron silica spherical particles. When deposited on a substrate, they typically form random patterns. In this work, we introduce a method allowing one to influence the shape of the structures created on a substrate by the silica spheres. The silica spherical particles with diameter of about 500 nm where deposited on silicon substrates using a simple process of sedimentation. Various structures, like grooves and pits, were earlier prepared by wet etching on surfaces of these silicon substrates. The process led to arranging the silica spheres within the silicon structures, reproducing the shapes of the substrates. The preliminary results are documented by the images from a scanning electron microscope (SEM). Further research on improvement of the patterns forming is under way.
Wydawca
Rocznik
Strony
835--841
Opis fizyczny
Bibliogr. 7 poz.
Twórcy
  • Wrocław University of Technology, Institute of Materials Science and Applied Mechanics, ul. Smoluchowskiego 25, 50-370 Wrocław, Poland
Bibliografia
  • [1] BRINKER C.J., SCHERER G.W., Sol-Gel Science, Academic Press, San Diego, 1990.
  • [2] LI ZH.-ZH., WEN L.-X., SHAO L., CHEN JI.-F., J. Contr. Rel., 98 (2004), 245.
  • [3] JASIORSKI M., BAKARDIJEVA S., DOROSZKIEWICZ W., BRZEZIŃSKI S., MALINOWSKA G., MARCINKOWSKA D., ORNAT M., STRĘK W., MARUSZEWSKI K., Mater. Sci.-Poland, 22 (2004), 137.
  • [4] JASIORSKI M., MARUSZEWSKI K., STRĘK W., Mater. Sci.-Poland, 20 (2002), 51.
  • [5] RECULUSA S., MASSÉ P., RAVAINE S., J. Coll. Int. Sci., 279 (2004), 471.
  • [6] STÖBER W., FINK A., BOHN E., J. Coll. Int. Sci., 26 (1968), 62.
  • [7] ZUBEL I., Forming spatial structures in silicon by anisotropic etching for applications in microelectronics (in Polish), Wrocław Technical University Press, Wrocław, 2004.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BPW7-0007-0093
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