Effects of an external magnetic field on the perpendicular magnetic anisotropy of electrodeposited micro-patterned arrays

• Autorzy: Jeung W. Y. , Choi D. H. , Lee K. H.
• Języki publikacji: EN

Abstrakty

EN

We have investigated effects of an external magnetic field on PMA (perpendicular magnetic anisotropy) for electrodeposited continuous films and micro-patterned arrays. For continuous films, external magnetic field gave rise to a highly aligned grain structure with a PMA. Our results indicated that the effect of applied magnetic field is apparent only under specific current density. XRD patterns showed that electrodeposited continuous Co films consist of hexagonal cobalt only and have strong texture for grains with c-axis lying perpendicular to the film plane. The patterned arrays were fabricated by UV-LIGA process, and PMA was modified by changing the aspect ratio of patterned arrays. Our results suggest that there is a critical aspect ratio at which PMA dominates in-plane anisotropy. For the patterned arrays, however, an external magnetic field was little effective due to large concentration polarization.

Słowa kluczowe

EN

cobalt; magnetic field; perpendicular anisotropy; electrodeposition

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Materials Science
• Rocznik: 2003
• Tom: Vol. 21, No. 1
• Strony: 147--154
• Opis fizyczny: Bibliogr. 11 poz.

Twórcy

autor

Jeung W. Y.

• Metal Processing Research Center, Korea Institute of Science and Technology, Seoul, Korea

autor

Choi D. H.

• Metal Processing Research Center, Korea Institute of Science and Technology, Seoul, Korea

autor

Lee K. H.

• Metal Processing Research Center, Korea Institute of Science and Technology, Seoul, Korea

Bibliografia

• [1] Horkans J., Seagle D. J., Chang I.H., J. Electrochem. Soc., 137 (1990), 2056.
• [2] Myung N.V., Yang H., Schwartz M., Judy J.W., Yang C.K., Nobe K., Abstracts of 198th ECS Meeting, 2000-2 (2000), 583.
• [3] Ross C.A., Haratani S., Castano F.J., Hao Y., Hwang M., Shima M., Cheng J.Y., J. Appl. Phys., 91 (2002), 6848.
• [4] Sung M., Zangari G., Metzger R.M., IEEE Trans. Magn., 36 (2000), 3005.
• [5] Lee K.H., Kim G.H., Jeung W.Y., Electrochem. Commun, 4 (2002), 605.
• [6] Datta M., Landolt D., Electrochim. Acta, 45 (2000), 2535.
• [7] Osaka T., Kasai N., KoiwaI., GotoF., SuganumaY., J. Electrochem. Soc., 130 (1983), 568.
• [8] Dini J.W., Plat. Surf. Finish., 75 (1988), 642.
• [9] Dini J.W., Electrodeposition (Chapter 6), NOYES Publications, New Jersey, 1992.
• [10] US Patent 3, 652, 442 (1972), 4, 102, 756 (1978).
• [11] Mehdizadeh S., Dukovic J., Andricacos P.C., Romaniciw L.T., ChehH.Y., J. Electrochem. Soc., 140 (1993), 3497.