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Thermal characterization of copper thin films made by means of sputtering

Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Copper thin films have been deposited onto Corning glass substrates by means of two kinds of DC magnetron sputtering. The goal of this research was to study differences in thermal characteristics of both kinds of the films. The differences between these layers originate from the technological processes; one of them employs an inert gas -- argon -- in the vacuum chamber, and the other is the so-called "pure" self-sputtering. Thermal characterization of the layers was performed using the scanning thermal microscopy (SThM) as well as a far field thermographical system.
Słowa kluczowe
Czasopismo
Rocznik
Strony
339--343
Opis fizyczny
Bibliogr.17 poz.
Twórcy
  • Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
  • Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
  • Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
autor
  • Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
autor
  • Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wrocław, Poland
Bibliografia
  • [1] Vinci R.P., Zieliński E.M., BravmanI.C., Thin Solid Films, 262 (1995), 142.
  • [2] Gutman R.J., Chow T.P., Koloyeros A.E., Lanford W.A., Muraka S.P., Thin Solid Films, 262 (1995), 177.
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  • [6] Posadowski W.M., Vacuum, 53 (1999), 11.
  • [7] Posadowski W.M., Thin Solid Films 392 (2001), 201.
  • [8] Szeloch R.F., Gotszalk T.P., Gumienny Z., Proc. of the Seminar Thermic '98, Zakopane (1998), p. 45.
  • [9] Szeloch R.F., Gotszalk T.P., Radojewski J., Janus P., Orawski W., Pędrak R., Proc. of Micro- Mat 2000, Berlin (2000), p. 1257.
  • [10] Szeloch R.F., Gumienny Z., Sołtysiak R., Regeńczuk R., Proc. of ISHM Conf., Warsaw, Poland (1990), p. 78.
  • [11] Binnig G., Rohrer H., Helv. Phys. Acta., 55 (1982), 726.
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  • [13] Williams C.C., Wickramasinghe H.K, Appl. Phys. Lett., 49 (1986), 1587.
  • [14] Dinwiddie R.B., Pylkki R.J., West P.E., Thermal Conductivity 22 (1994), 668.
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  • [16] Szeloch R.F., Gotszalk T.P., Janus P., Microelectronics Reliability, 42 (2002), 1719.
  • [17] www.thermomicro.com Scanning Thermal Microscopy (SThM) and its Application in Thermal Characterization of Semiconductor and Advanced Material Surfaces.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BPW7-0005-0090
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