Electrochemical evaluation of protective properties of one-component SiO2 and TiO2 coatings obtained by the sol-gel method

• Autorzy: Szałkowska E. , Masalski J. , Głuszek J.
• Języki publikacji: EN

Abstrakty

EN

The paper presents the corrosion resistance of uncoated steel and steel coated with one-component films in 0.5 M H2SO4 at 22.0 0.2 °C. One-component coatings were obtained by the sol-gel method. The coatings were obtained by the dip coating method. Quantitative composition of the coatings and their thickness were estimated by means of X-ray Photoelectron Spectroscopy (XPS). The corrosion behaviour of steel coated with one-component films was evaluated with the use of electrochemical direct and alternating current methods.

Słowa kluczowe

EN

sol-gel method; XPS metod; potentiodynamic curves; impedance

• Wydawca: Oficyna Wydawnicza Politechniki Wrocławskiej
• Czasopismo: Materials Science
• Rocznik: 2003
• Tom: Vol. 21, No. 4
• Strony: 367--376
• Opis fizyczny: Bibliogr. 18 poz.

Twórcy

autor

Szałkowska E.

• Department of Chemistry, Częstochowa University of Technology, al. Armii Krajowej 19, 42-200 Częstochowa, Poland

autor

Masalski J.

• Institute of Inorganic Technology and Mineral Fertilizers, Wroclaw University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wroclaw, Poland

autor

Głuszek J.

• Institute of Inorganic Technology and Mineral Fertilizers, Wroclaw University of Technology, Wybrzeże Wyspiańskiego 27, 50-370 Wroclaw, Poland

Bibliografia

• [1] Brinker C.J., Scherer G.W., Sol-gel: the physics and chemistry of sol-gel processing, Academic Press, San Diego, 1990.
• [2] Klotz M„ Ayral A., Guizard C„ Cot L„ Bull. Korean Chem. Soc., 20 (1999), 879.
• [3] Kundu D„ Biswas P.K., Ganguli D., J. Non-Cryst. Solids, 110 (1989), 13.
• [4] Andrianov K.A., Organic Silicon Compounds (in Russian), Gos. Nauchno-Tekhn. Izd. Khim. Lit., Moscow, 1955.
• [5] Atik M., DeLimaNeto P., Aegerter M. A., AvacaL. A., J. Appl. Electrochem., 25 (1995), 142.
• [6] Atik M., Zarzycki J., J. Mat. Sei. Letters, 13 (1994), 1301.
• [7] Vasconcelos D.C.L., Carvalho J.A.N., MantelM., Vasconcelos W.L, J. Non-Cryst. Solids, 273 (2000), 135.
• [8] Gluszek J., Masalski J., Zabrzeski J., Nitsch K., Gluszek P., Thin Solid Films, 349 (1999), 186.
• [9] Makishima A., Oohashi H., Wakakuwa M., J. Non-Cryst. Solids, 42 (1980), 545.
• [10] Kamiya K.,. Sakka S., Taternicki T, J. Mater. Sei., 15 (1980), 1765.
• [11] Makishima A., Asami M., Wada K., J. Non-Cryst. Solids, 121 (1990), 310.
• [12] Anderson M.L., Stroud R.M., Morris C.A., Merzbacher C.I., Rolison D.R., Adv. Eng. Materials, 8 (2000), 481.
• [13] Garbassi F., Balducci L., Ungarelli R., J. Non-Cryst. Solids, 223 (1998), 190.
• [14] Holmes-Farley S. R„ Yanyo L. C„ Adhesion Sei. Technol., 5 (1991), 131.
• [15] Atik M., Messaddeg S.H., Luma F.P., Aegerter M.A., J. Mat. Sei. Letters, 15 (1996), 2051.
• [16] Hench L.L., Wang S.H„ Phase Trans., 24 (1990), 785.
• [17] Biswas R.G., Sanders R.D., J. Mat. Eng. Perf., 7 (1998), 727.
• [18] Juttner K., Electrochim. Acta, 35 (1990), 1501.