Thermal Analysis of the Heat Exchanger for Power Electronic Device with Higher Power Density

• Autorzy: Liang Y. , Zhang J. , Li M. , Guo Y. , Yuan J.

Warianty tytułu

PL

Termiczna analiza wymiany ciepła w urządzeniach energoelektronicznych o dużej gęstości mocy

• Języki publikacji: EN

Abstrakty

EN

Liquid cooling system has been used in high power electronic device systems to cool down the temperature of power electronic device. Heat exchanger is an important part of liquid cooling system to transfer the heat generated by power electronic device into air. In this paper, a Streamline-upwind/Petrov-Galerkin (SUPG) stabilized finite element analysis method was proposed to solve the water and air governing formulas including the mass conservation equation, the momentum conservation and the energy conservation equation. Furthermore, the thermal characteristic of a heat exchanger is simulated and the result was compared with an experiment. The comparison shows that this method is effective.

PL

W artykule przedstawiono zagadnienie kontroli systemów chłodzenia w urządzeniach energoelektronicznych. Zaproponowano metodę SUPG (ang. Streamline-Upwind Petrov-Galerkin) do obliczania rozpływu cieczy i powietrza, z uwzględnieniem oszczędności ilości, energii oraz pędu środka chłodzącego. Otrzymane charakterystyki wymiany ciepła zostały przebadane symulacyjnie, a wyniki porównano z badaniami eksperymentalnymi.

Słowa kluczowe

EN

power electronic device; liquid cooling system; heat exchanger; Streamline-upwind/Petrov-Galerkin; finite element analysis

PL

urządzenia energoelektroniczne; system chłodzenia cieczą; SUPG; analiza metodą elementów skończonych

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Przegląd Elektrotechniczny
• Rocznik: 2012
• Tom: R. 88, nr 12a
• Strony: 328--332
• Opis fizyczny: Bibliogr. 12 poz., rys.

Twórcy

autor

Liang Y.

autor

Zhang J.

autor

Li M.

autor

Guo Y.

autor

Yuan J.

• School of Electrical and Information Science, Hebei University of Science and Technology, No.70 Yuhuadonglu, Shijiazhuang, Hebei China, 050018,

Bibliografia

• [1] Hsueh-Rong Chang, Jiankang Bu, George Kong and Ricky Labayen, 300A 650V 70um Thin IGBTs with Double-Side Cooling, Proceedings of the 23rd International Symposium on Power Semiconductor Device & IC’s, 2011 San Diego, CA, 2011
• [2] John Vetrovec, Active Heat Sink for Automotive Electronics, International Journal of Passengar Cars-Electronic Electrical System 1(2009) 336-343.
• [3] Chan-Su Yun, Paolo Malberti, Mauro Ciappa, Wolfgang Fichtner, Thermal Component Model for Electrothermal Analysis of IGBT Module Systems, IEEE Transactions on Advanced Packaging 3(2001) 401-406
• [4] M. Bartram, M. Schrey, H. Kuhn, Rik W. De Donchker, A New Approach to Optimize IGBT-Heatspreader-combinations Allow “real-time” Simulation of IGBT-Chip-Temperature, 35th Annual IEEE Power Electronics Specialists Conference, Aachen, Germay, 2004
• [5] Javier Valenzuela, Thomas Jasinski, Zahed Sheikh, Liquqid Cooling for High-Power Electronics, Power Electronics Technology (2005) 50-56
• [6] Andrei Blinov, Dmitri Vinnikov, Cooling Methods for High-Power Electronic Systems, Scientific Journal of Riga Technical University 29(2011) 79-86
• [7] J. Biela, J. W. Kolar, Cooling concepts for High Power Density Magnetic Devices, Power Conversion Conference, Nagoya, 2007.
• [8] C. Simpson, Liquid cooling for wide bandgap semiconductor technology, presented at Adv. Liquid Cooling Workshop, 2003.
• [9] Jeremy C. Howes, David B. Levett, Shawn T. Wilson, et al, Cooling of an IGBT Drive System with Vaporizable Dielectric Fluid (VDF), 24th IEEE SEMI-THERM Symposium, San Jose, CA, 2008
• [10] Schulz-Harder Juergen, Exel Karl, Meyer Andreas, Direct Liquid Cooling of Power Electronics Devices, 4th International Conference on Integrated Power Systems, Naples, Italy, 2006
• [11] Avijit Bhunia, Sriram Chandrasekaran, Chung-Lung Chen, Performance Improvement of a Power Conversion Module by Liquid Micro-Jet Impingement Cooling, IEEE Transactions on Components and Packaging Technology 2(2007) 309-316
• [12] T. Wenquan, Numerical Transfer, Xi’an Jiaotong University Press, Xi’an, China, 2001.