Reactions of methane in dielectric-barrier discharges

• Autorzy: Górska A. , Sentek J. , Krawczyk K. , Schmidt-Szałowski K.
• Języki publikacji: EN

Abstrakty

EN

The reactions of methane under the conditions of barrier discharges were studied in the mixtures: 1) 50% CH₄+ 50% Ar, 2) 50%CH₄+ 25%CO₂+ 25% Ar, and 3) 50%CH₄+ 50%CO₂, under atmospheric pressure at about 50°C and about 300°C. Besides hydrogen, ethane was the main gaseous product of the reaction, with small additions of ethylene and acetylene. An increase of the overall methane conversion and conversion into C₂ hydrocarbons was observed in cases where grains of quartz glass was packed in the discharge gap.

Słowa kluczowe

EN

methane conversion; dielectric-barrier discharges; C2 hydrocarbons

PL

metan; wyładowanie; C2; węglowodory

• Wydawca: Centrum Materiałów Polimerowych i Węglowych PAN
• Czasopismo: Polish Journal of Applied Chemistry
• Rocznik: 2005
• Tom: Vol. 49, nr 1-2
• Strony: 91--100
• Opis fizyczny: Bibliogr. 27 poz., Tabl. 1, Rys. 8

Twórcy

autor

Górska A.

• Faculty of Chemistry, Warsaw University of Technology, Noakowskiego 3, 00-664 Warszawa, Poland

autor

Sentek J.

• Faculty of Chemistry, Warsaw University of Technology, Noakowskiego 3, 00-664 Warszawa, Poland

autor

Krawczyk K.

• Faculty of Chemistry, Warsaw University of Technology, Noakowskiego 3, 00-664 Warszawa, Poland

autor

Schmidt-Szałowski K.

• Faculty of Chemistry, Warsaw University of Technology, Noakowskiego 3, 00-664 Warszawa, Poland

Bibliografia

• [1] K. Schmidt-Szałowski, T. Opalińska, J. Sentek, K. Krawczyk, J. Ruszniak, T. Zieliński and K. Radomyska, J. Advanced Oxidation Technol., 7, 39 (2004).
• [2] K. Thanyachotpaiboon, S. Chavadej, T.A. Caldwell, L.L. Lobban and R.G. Malinson, Kinetics&Catalysis, 44/10, 2252-2257 (1998).
• [3] K.V. Kozlov, P. Michel and H.E. Wagner, Proc. Hakone VI, Cork 1998, p. 78-82.
• [4] J. Sentek, K. Radomyska and K. Schmidt-Szałowski, Acta Agrophysica, 80, 149-157 (2002).
• [5] Y. Zhang, Y. Li, Y Wang, C. Liu and B. Eliasson, Fuel Processing Technol, 83, 101-109 (2003).
• [6] K. Okazaki and T. Kishida, Proc. 14 ISPC Praha 1999, p. 2283-2288.
• [7] M. Okumoto and A. Mizuno, Catalysis Today, 71, 211-217 (2001).
• [8] T. Nozaki, A. Hattori, S. Kado and K. Okazaki, Proc. 16 ISPC, Taormina 2003, p. 451.
• [9] Y. Sekine, K. Urasaki, S. Kado, S. Asai and E. Kikuchi, Proc. 16 ISPC, Taormina 2003, p. 415.
• [10] S. Yao, a. Nakayama and E. Suzuki, Catal. Today, 71, 218-223 (2001).
• [11] S. Kado, K. Urasaki, Y. Sekine and K. Fujimoto, Fuel, 82, 1377-1385 (2003).
• [12] S. Kado, Y. Sekine, N. Muto, T. Nozaki and K. Okazaki, Proc 16 ISPC, Taormina 2003, p. 406.
• [13] R.F. Venugopalan and S. Veprek, Topics in Current Chemistry: Plasma Chemistry IV, Boschke, F.L. Ed., Springer Verlag, New York 1983, p. 107.
• [14] S.L. Suib and R.R Zerger, J. Catal., 139, 383-391 (1993).
• [15] Liu Chang-Jun, R. Mallinson and L. Lobban, J. Catalysis, 179, 326-334 (1998).
• [16] Liu Chang-Jun, A. Marafee, R. Mallinson and L. LOBBAN, Appl.. Catal. A: General, 164, 21-33 (1997).
• [17] Liu Chang-Jun, R. Mallinson and L. Lobban, Appl. Catalysis A: General, 178, 17-27 (1999).
• [18] X. Zhang, B. Dai, A. Zhu, W. Gong and Ch. Liu, Catalysis Today, 72, 223-227 (2002).
• [19] T. Jiang, Y. Li, C-J. Liu, G-H. Xu, B. Eliasson and B. Xue, Catal. Today, 72, 229-235 (2002).
• [20] W. Cho, Y. Baek, S. Moon and Y.C. Kim, Catal. Today, 74, 207-223 (2002).
• [21] M. Heintze and M. Magureanu, J. Catal, 206, 91-97 (2002).
• [22] K. Schmidt-Szałowski and W. Zarębski, J.Chim.Phys. 88, 1849-1863 (1991).
• [23] M. Kraus, U. Kogelschatz, B. Eliasson and A. Wokaun, Paul-Scherrer-Institute, Villigen, Switzerland and ABB Corporate Research Ltd., Baden, Switzerland.
• [24] A. Oumghar, J.C. Legrand, A.M. Diamy and N. Turillon, Plasma Chem. Plasma Proc., 15, 87 (1995).
• [25] T. Nozaki, N. Muto, S. Kado and K. Okazaki, Catalysis Today, 89, 57-65 (2004).
• [26] U. Kogelschatz, Plasma Chem. Plasma Proc., 23, 1-46 (2003).
• [27] M. Młotek, J. Sentek, K. Krawczyk, K. Schmidt-Szałowski, (this issue p. 71).