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Nowe możliwości projektowania elektromagnetycznej struktury pasmowej i ich wpływ na szumy oraz sygnał
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Power/Ground plane structure is the best configuration of the modern plane power distribution system. But in the high speed circuit, the resonant modes of the P/G planes can be excited when the high speed signal changes the reference plane. Thus it brings the ground bounce noise (GBN) and simultaneous switching noises (SSN) problems. This paper presents a novel electromagnetic bandgap structure which can suppress the high frequency and ultra-high frequency GBN and SSN by using a special S shape slender to connect the EBG unit. But the structure has a certain effect on the signal transmission features, while the simulation results show that loading the EBG structure in partial is not only able to restrain the GBN and SSN effectively, but also able to achieve good propagation characteristics.
W artykule analizowane są szumy typu GBN I SSN. Zaprezxentoewano nową elektrlomagnetyczną strukturę pasmową umożliwiająca tłumienie tych szumów przy wysokich częstotliwościach.
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Czasopismo
Rocznik
Tom
Strony
72--77
Opis fizyczny
Bibliogr. 17 poz., il., wykr.
Bibliografia
- [1] M.Swaminathan and A.Ege Engin, Power Intergrity Modeling and Design for Semiconductors and Systems. Englwood Cliffs, NJ: Prentice-Hall, 2007.
- [2] R.R.Tummala, “SOP: What is it and why? A new microsystemintegration technology paradigm-Moore’s law for system integration of miniaturized convergent systems of the next decade, IEEE Trans. Adv. Packag., vol. 27, no. 2, pp. 241–249, May 2004.
- [3] A. Muhtaroglu, G. Taylor, and T.Rahal-Arabi, “Ondie drop detector for analog sensing of power supply noise”, IEEE Journal of Solid-state Circuit, vol. 39, no. 4, pp. 651–660, Apr. 2004.
- [4] J.Fan, J.L. Drewniak, J.L. Knighten, N.W.Smith, A. Orlandi, O.P. Van Doren, T.H. Hubing, and R.E.Dubroff, “Quantifying SMT decoupling capacitor placement in DC power-bus design for multilayer PCBs”, IEEE Trans. Electromagn. Compat., vol. 43, no. 4, pp. 588-599, Nov. 2001.
- [5] J.Fan, W. Cui, J.L. Drewniak, T.P. Van Doren, and J.L. Knighten, “Estimating the noise mithgation effect of local decoupling in printed circuit boards”, IEEE Trans. Adv. Packag., vol. 25, no. 2, pp. 154-165, May 2002.
- [6] R. Abhari and G.V.Eleftheriades, “Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits”, IEEE Trans.Microw.Theory Tech., vol.51, no.6, pp.1629-1639, Jun.2003.
- [7] T.L. Wu, Y.H. Lin, and S.T. Chen, “A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures”, IEEE Microw. Wireless Compon . Lett., Vol.14, no. 7, pp.337-339, Jul.2004.
- [8] L.Yang and Z. Feng “Advanced methods to improve compactness in EBG design and utilization,” in Proc. Int. Symp. Antenna Propag. Soc. vol. 4, pp.3585-3588, Jun.2004.
- [9] T.L.Wu and S.T.Chen, “A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit”, IEEE Trans. Microw. Theory Tech., Vol.54, no. 8, pp.3398-3406, Aug.2006.
- [10] T.K.Wang, T.W.Han, and T.L.Wu, “A novel power/ground layer using artificial substrate EBGfor simultaneously switching noise suppression”, IEEE Trans. Microw. Theory Tech., vol.56, no. 5, pp. 1164-1171, May 2008.
- [11] T.L. Wu, C.C. Wang, Y.H. Lin, T.K. Wang, and G. Chang, “A novel power plane with super-wideband elimination of ground bounce noise on high speed cirduits”, IEEE Microw. Wireless Compon. Lett., vol.15, no.3, pp. 174-176, Mar.2005.
- [12] K.C. Hung, D.B. Lin, C.T. Wu, and L. Wu, “Mitigaton of simultaneous switching noise in high speed circuit using electromagnetic bandgap structures with interdigial meander bridge”, in Proc. Int. Inf., Commun. Signal Process. Conf., Dec. 2007, pp.1-5.
- [13] K.H. Kim and J.E. Aine, “Design of EBG power distribution networks with VHF-band cutoff frequency and small unit cell size for mixed-signal systems”, IEEE Microw. Wireless Compon. Lett., vol.17, no. 7, pp.489-491, Jul.2007.
- [14] Tzong-Lin Wu, “Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation”, Electromagnetic Compatibility,vol.52, pp.346-356,2010.
- [15] S. Shahparnia and O. M. Ramahi, “Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces”, Electron. Lett.,vol. 40, no. 2, Jan. 2004.
- [16] Sievenpiper D. High-impedance electromagnetic surfaces. [Ph. D. dissertation], Dept. Electrical Engineering, Univ.California, Los Angeles, CA, 1999
- [17] Remski R. “Analysis of EBG surfaces using Ansoft HFSS”, Microwave J, vol.43, no.9, pp.190-198, 2000.
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Bibliografia
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bwmeta1.element.baztech-article-BPOH-0062-0018