Overheat protection circuit for high frequency processors

• Autorzy: Frankiewicz M. , Kos A.
• Języki publikacji: EN

Abstrakty

EN

The paper describes design and structure of the overheat protection circuit based on the PTAT sensors. The digital core of the system is driven by a 3-bit information generated by the structure. As a result, behaviour of the core differs for each temperature. The circuit was designed in LF CMOS 0.15 ěm technology using full-custom technique. The presented paper focuses especially on the structure of the overheat protection circuit and simulations results of the functional blocks of the system. Layout and some parameters of the circuit are also considered.

Słowa kluczowe

EN

PTAT; overheat; CMOS; VLSI; full-custom design

• Wydawca: Polska Akademia Nauk, Wydział IV Nauk Technicznych
• Czasopismo: Bulletin of the Polish Academy of Sciences. Technical Sciences
• Rocznik: 2012
• Tom: Vol. 60, nr 1
• Strony: 55--59
• Opis fizyczny: Bibliogr. 11 poz., rys., tab.

Twórcy

autor

Frankiewicz M.

autor

Kos A.

• AGH University of Science and Technology, Department of Electronics, 30 A. Mickiewicza Ave., 30-059 Kraków, Poland,

Bibliografia

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• [2] W. Huang, M.R. Stan, S. Gurumurthi, R.J. Ribando, and K. Skadron, “Interaction of scaling trends in processor architecture and cooling”, Proc. 26th IEEE Semiconductor Thermal Measurement and Management Symp. SEMI-THERM 1, 198–204 (2010).
• [3] V. Sz´ekely, C. M´arta, Z. Koh´ari, and M. Rencz, “CMOS sensors for on-line thermal monitoring of VLSI circuits”, IEEE Trans. VLSI Systems 5 (3), 270–276 (1997).
• [4] V. Sz´ekely, M. Rencz, A. P´ahi, and B. Courtois, “Thermal monitoring and testing of electronic systems”, IEEE Trans. Comp. and Pack. Techn. 22 (2), 231–237.
• [5] M. Szermer, M. Janicki, Z. Kulesza, and A. Napieralski, “Practical realization of PTAT sensor for ASIC overheat protection”, Proc. 15th Int. Workshop on Thermal Investigations of ICs and Systems THERMINIC’2009 1, 80–83 (2009).
• [6] S. Ankireddi and D. Copeland, “Thermo-mechanical reliability considerations with dynamic voltage/frequency scaling in microprocessor applications”, Proc. 25th IEEE Semiconductor Thermal Measurement and Management Symp. SEMI-THERM 1, 134–138 (2009).
• [7] A. Gołda and A. Kos, “Effective supervisors for predictive methods of dynamic power management”, Proc. 14th Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES’2007 1, 381–386 (2007).
• [8] M.A. Elsawaf, H.A. Hafmy, and A.L. Elshafei, “CPU dynamic thermal management via thermal spare cores”, Proc. 25th IEEE Semiconductor Thermal Measurement and Management Symp. SEMI-THERM 1, 139–145 (2009).
• [9] A. Gołda and A. Kos, “Analysis and design of PTAT temperature sensor in digital CMOS VLSI circuits”, Proc. 13th Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES’2006 1, 415–420 (2006).
• [10] A. Gołda and A. Kos, “Parameters identification of embedded PTAT temperature sensors for CMOS circuits”, Proc. 14th Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES’2007 1, 392–395 (2007).
• [11] M. Frankiewicz, P. Mroszczyk, A. Gołda, and A. Kos, “Asynchronous 4-bit CMOS flash analog-to-digital converter with over- and underflow detection system”, Proc. 16th Int. Conf. Mixed Design of Integrated Circuits and Systems MIXDES’2009 1, 234–237 (2009).