Vacuum microdevices

• Autorzy: Grzebyk T. , Górecka-Drzazga A.
• Języki publikacji: EN

Abstrakty

EN

In the paper MEMS-type microsystems working in vacuum conditions are described. All the benefits and drawbacks of vacuum generated in microcavities are discussed. Different methods are used to produce vacuum in microcavity of MEMS. Some bonding techniques, sacrificial layer method or getter materials are presented. It is concluded that the best solution would be to invent some kind of vacuum micropump integrated with MEMS structure. Few types of already existing vacuum micropumps are shown, but they are not able to generate high vacuum. As the most promising candidate for miniaturization an orbitron pump was selected. The working principle and novel concepts of its construction are described. The most important part of the micropump, used for gas ionization, is a field-emission electron source. Results of a research on a lateral electron source with gold emissive layer for integration with a micropump are presented.

Słowa kluczowe

EN

vacuum microsystems; miniature vacuum pump; field-emission electron source; MEMS

• Wydawca: Polska Akademia Nauk, Wydział IV Nauk Technicznych
• Czasopismo: Bulletin of the Polish Academy of Sciences. Technical Sciences
• Rocznik: 2012
• Tom: Vol. 60, nr 1
• Strony: 19--23
• Opis fizyczny: Bibliogr. 12 poz., rys., tab.

Twórcy

autor

Grzebyk T.

autor

Górecka-Drzazga A.

• Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, 11/17Janiszewskiego St., 50-372 Wrocław, Poland,

Bibliografia

• [1] Vabond Project, “Long-term stability of vacuum-encapsulated MEMS devices using eutectic wafer bonding”, http://www.istworld.org (2002–2005).
• [2] T. Tsuchiya, Y. Kageyama, H. Funabashi, and J. Sakata, “Polysilicon vibrating gyroscope vacuum-encapsulated in an on-chip micro chamber”, Sensors and Actuators A 90, 49–55 (2003).
• [3] I. Kleps, A. Angelescu, N. Samfirescu, A. Gil, and A. Correia, “Study of porous silicon, silicon carbide and DLC coated field emitters for pressure sensor application”, Solid-State Electronics 45, 997–1001 (2001).
• [4] S. Miller and M. Desmulliez, “MEMS ultra low leak detection methods: a review”, Sensor Review 29 (4), 339–344 (2009).
• [5] S.J. Randolph, M.D. Hale, M.A. Guillorn, P.D. Rack, and M.L. Simpsonet, “A microfabrication process for a vacuumencapsulated microchamber”, Microelectronic Engineering 77, 412–419 (2005).
• [6] Page films brochure of SaesGetters Group, http://www.saesgetters.com/ (2007).
• [7] P. Kowalski, B. Latecki, Z. Gniazdowski, W. Milczarek, and K. Skwara, “A silicon gas micro pump with the piezoelectric driver”, Electronics 6, 81–83 (2010), (in Polish).
• [8] Shamus McNamara, “On-Chip vacuum generated by a micromachined Knudsen pump”, J. Microelectromechanical Systems 14 (4), 741–745 (2005).
• [9] M. Doms and J. Mueller, “A micromachined vapor jet pump”, Sensors and Actuators A 119, 462–467 (2005).
• [10] P.K. Naik and R.G. Herb, “Glass orbitron of 5-cm diameter”, J. Vac. Sci. Technol. 5, 42–44 (1967).
• [11] J.Z. Wilcox, T. George, and J. Feldman, Nasa Tech. Brief 23 (9), 1–2 (1999).
• [12] H. Koops, “A miniaturized Orbitron pump for MEMS applications”, Technical Digest 18th Int. Vacuum Nanoelectronics Conf. IV NC 1, 364–365 (2005).