DC characteristics of the SiC Schottky diodes

• Autorzy: Janke W. , Hapka A. , Oleksy M.
• Języki publikacji: EN

Abstrakty

EN

The isothermal and non-isothermal characteristics of silicon carbide Schottky diodes in the wide range of currents and ambient temperatures are investigated in this paper. The measurements of the diodes characteristics have been performed with the use of a pulse method, with fast registration of measurement points after the diode current turning on, or with the use of a fully static method, in which the self-heating phenomenon is taken into account. Apart from the measurements, the series of numerical experiments, giving the isothermal and non-isothermal characteristics as a result, were executed. The complex, accurate numerical procedures as well as simplified analytical calculations were implemented. A good conformity of all calculation and measurement results have been obtained. In the presented investigations, for relatively high currents and ambient temperatures, the influence of self-heating on the SiC Schottky diodes static characteristics is significant. The large (even 4 V for the ambient temperature 300.C ) values of voltages corresponding to the nominal diode currents have been observed.

Słowa kluczowe

EN

silicon carbide; Schottky diodes; static characteristics; high-temperature

• Wydawca: Polska Akademia Nauk, Wydział IV Nauk Technicznych
• Czasopismo: Bulletin of the Polish Academy of Sciences. Technical Sciences
• Rocznik: 2011
• Tom: Vol. 59, nr 2
• Strony: 183--188
• Opis fizyczny: Bibliogr. 15 poz., rys., tab.

Twórcy

autor

Janke W.

autor

Hapka A.

autor

Oleksy M.

• Department of Electronics and Informatics, Koszalin University of Technology, 2 Śniadeckich St., 75-453 Koszalin, Poland,

Bibliografia

• [1] P. Friedrichs, “Silicon carbide power-device products – status and upcoming challenges with a special attention to traditional, nonmilitary industrial applications”, Phys. Stat. Sol. B 245 (7), 1232–1238 (2008).
• [2] O.J. Guy, M. Lodzinski, A. Castaing, P.M. Igic, A. Perz-Tomas, M.R. Jennings, and P.A. Mawby, “Silicon carbide Schottky diodes and MOSFETs: solutions to performance problems”, IEEE Power Electronics and Motion Control Conf. 1, 2464–2471 (2008).
• [3] G. Majumdar and T. Oomori, “Some key researches on SiC device technologies and their predicted advantages”, Power Semiconductors 6, 18–229 (2009).
• [4] T. Funaki, J.C. Balda, J. Junghans, A.S. Kashyap, H.A. Mantooth, F. Barlow, T. Kimoto, and T. Hikihara, “Power conversion with SiC devices at extremely high ambient temperatures”, IEEE Trans. on Power Electronics 22 (4), 1321–1329 (2007).
• [5] http://www.cree.com/products/power docs2.asp
• [6] http://www.sensitron.com/data sheets/5015.pdf.
• [7] K. Sheng, “Maximum junction temperatures of SiC power devices”, IEEE Trans. on Electronic Devices 56 (2), 337–342 (2009).
• [8] S. Pyo and K. Sheng, “Junction temperature dynamics of power MOSFET and SiC diode”, Proc. IPEMC 1, 269–271 (2009).
• [9] B. Wrzecionko, J. Biela, and J.W. Kolar, “SiC power semiconductors in HEVs: influence of junction temperature on power density, chip utilization and efficiency”, Preprint of Proc. IECON 1, CD-ROM (2009).
• [10] W. Janke and A. Hapka, “Nonlinear thermal characteristics of silicon carbide devices”, Materials Science and Engineering, 8th Int. Conf.on Electronic Devices 1, CD-ROM (2003).
• [11] W. Janke, Thermal Phenomena in Semiconductor Elements and Systems WNT, Warszawa, 1992, (in Polish).
• [12] PSPICE Manual, http://www.electronics-lab.com/downloads/schematic/013/tutorial/PSPCREF.pdf.
• [13] W. Janke and A. Hapka, “Inluence of series resistance on thermal limitations of SiC Schottky diodes”, Int. Conf. 5th Wide Bandgap Materials – Progress in Synthesis and Applications 1, CD-ROM (2010).
• [14] W. Janke and A. Hapka, “The current-voltage characteristics of SiC Schottky barrier diodes with the self-heating included”, 16th Int. Workshop on Thermal Investigations of ICs and Systems 1, CD-ROM (2010).
• [15] W. Janke, A. Hapka, and M. Oleksy, “Silicon carbide Schottky diode – a promising device for power electronics”, PPEE 1, 247–252 (2007).