Techniki chłodzenia elementów elektronicznych

• Autorzy: Jaworski M.
• Języki publikacji: PL

Słowa kluczowe

PL

wrzenie w kanałach; techniki chłodzenia; elementy elektroniczne

EN

cooling systems; boiling in cannals; electronic devices

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Chłodnictwo : organ Naczelnej Organizacji Technicznej
• Rocznik: 2008
• Tom: R. 43, nr 1-2
• Strony: 50--52
• Opis fizyczny: Bibliogr. 14 poz., rys.

Twórcy

autor

Jaworski M.

• Instytut Techniki Cieplnej Politechnika Warszawska

Bibliografia

• [1] BINTORO J. S., AKBARZADEH A., MOCHIZUKI M.: A closed-loop electronics cooling by implementing single phase impinging jet and mini channels heat exchanger. Applied Thermal Engineering, 25 (2005), 2740-2753.
• [2] CHEIN R., HUANG G.: Thermoelectric cooler application in electronic cooling. Applied Thermal Engineering 24 (2004), 2207-2217.
• [3] CHU R.C.: Thermal Management Roadmap. Cooling Electronic Products from Hand-Held Devices to Supercomputers. MIT Rohsenow Symposium, Cambridge, MA, 2003.
• [4] DARABI J., EKULA K.: Development of a chip-integrated micro cooling device. Microelectronics Journal, 34 (2003), l067-1074.
• [5] GILLOT CH., BRICARD A., SCHAEFFER CH.: Single- and two-phase heat exchangers for power electronic components. Int. J. Thermal Sciences, 39, (2000), 826-832.
• [6] LEON O., De MEY G., DICK E.: Study of the optimal layout of cooling fins in forced convection cooling. Microelectronics Reliability, 42 (2002), 1101-1111.
• [7] LIN L., PONNAPPAN R.: Heat transfer characteristics of spray cooling in a closed loop. International Journal of Heat and Mass Transfer, 46 (2003), 3737-3746.
• [8] LIN S., SEFIANE K., CHRISTY J.R.E.: Prospects of confined flow boiling i management of microsystems. Applied Thermal Engineering, 22 (2002), 825-837.
• [9] McGLEN R.J, JACHUCK R., LIN S.: Integrated thermal management techniques for high power electronic devices. Applied Thermal Engineering, 24 (2004), 1143-1156.
• [10] MOHAMED S. El-GENK M.S., SABER H.H., PARKER J.L.: Efficient spreaders for cooling high-power computer chips. Applied Thermal Engineering, 27 (2007), 1072-1088.
• [11] PASTUKHOV V.G., MAIDANIK YU.F., YERSHININ C.Y, KORUKOV M.A.: Miniature loop heat pipes for electronics cooling. Applied Thermal Engineering 23 (2003), 1125-1135.
• [12] PASTUKHOV V.G., MAYDANIK Y.F.: Low-noise cooling system for PC on the base of loop heat pipes. Applied Thcrmal Engineering, 27 (2007), pp. 894-901.
• [13] VASILIEV L.L.: Heat pipes in modern heat exchangers. Applied Thermal Engineering, 25 (2005), 1-19.
• [14] http://www.acktechnology.com