Modern micropassives: fabrication and electrical properties

• Autorzy: Dziedzic A.
• Języki publikacji: EN

Abstrakty

EN

This paper presents the concept and modem technological approach to the fabrication of discrete, integrated and integral micropassives. The role of these components in modem electronic circuits is discussed too. The material, technological and constructional solutions and their relation with electrical and stability properties are analyzed in details for linear and nonlinear microresistors made and characterized at the Faculty of Microsystem Technology, Wrocław University of Technology.

Słowa kluczowe

EN

resistor; varistor; thermistor; thick-film; LTCC; multichip module; geometrical properties; electrical properties; long-term stability; pulse durability; low-frequency noise; trimming

• Wydawca: Polska Akademia Nauk, Wydział IV Nauk Technicznych
• Czasopismo: Bulletin of the Polish Academy of Sciences. Technical Sciences
• Rocznik: 2006
• Tom: Vol. 54, nr 1
• Strony: 9--18
• Opis fizyczny: Bibliogr. 32 poz., 16 rys., 5 tab.

Twórcy

autor

Dziedzic A.

• Faculty of Microsystem Electronics and Photonics, Wrocław University of Technology, 27 Wybrzeże Wyspiańskiego St., 50-370 Wrocław, Poland,

Bibliografia

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• [23] A. Dziedzic, “Trimming and stability of thick-film resistors with reduced dimensions”, Proc. 25th IMAPS-Poland Conf., 163–166 (2001).
• [24] A. Dziedzic, A. Kolek, W. Ehrhardt, and H. Thust, “Advanced electrical and stability characterization of untrimmed and variously trimmed thick-film and LTCC resistors”, Microelectronics Reliability 46, 352–359 (2006).
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• [30] A. Dziedzic and W. Mielcarek, “Varistors in LTCC structures”, Proc. 38th Int. Conf. on Microelectronics, Devices and Materials MIDEM 2002, 253–257 (2002).
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