Conjugate numerical investigation of a miniature flat-plate evaporator of a capillary pumped loop for electronics cooling

• Autorzy: Wan Z. , Liu W. , Tu Z. , Nakayama A.
• Języki publikacji: EN

Abstrakty

EN

A capillary pumped loop (CPL) is a two-phase thermal control device applied in cooling electronic devices. A two-dimensional conjugate numerical model of a miniature flat-plate capillary evaporator is presented in order to describe liquid and vapor flow, heat transfer and phase change in the porous wick structure, liquid flow and heat transfer in the compensation cavity and heat transfer in the vapor grooves and the metallic wall. The entire evaporator is solved with the SIMPLE algorithm as a conjugate problem. The shape and location of the vapor-liquid interface inside the wick are calculated, and a side wall effect heat transfer limit is introduced to estimate the evaporator's heat transport capability. The influence of various wall materials on the evaporator's performance is discussed in detail. The results suggest that an evaporator with a combined wall is capable of dissipating high heat flux and stabilizing the temperature of electronic devices at a moderate temperature level.

Słowa kluczowe

EN

capillary pumped loop; flat plate evaporator; sidewall effect heat transfer limit; cooling of electronic devices

• Wydawca: Politechnika Gdańska
• Czasopismo: TASK Quarterly : scientific bulletin of Academic Computer Centre in Gdansk
• Rocznik: 2008
• Tom: Vol. 12, No 1-2
• Strony: 5--19
• Opis fizyczny: Bibliogr. 15 poz., rys.

Twórcy

autor

Wan Z.

autor

Liu W.

autor

Tu Z.

autor

Nakayama A.

• College of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan, 430074, P.R. China,

Bibliografia

• [1] McGlen R J, Jachuck R and Lin S 2004 Appl. Thermal Engng 24 (8) 1143
• [2] Garimella S V 2006 Microelectronics J. 37 (11) 1165
• [3] Riehl R R and Dutra T 2005 Appl. Thermal Engng 25 (1) 101
• [4] Pouzet E, Joly J L, Platel V, Grandpeix J- Y and Butto C 2004 Int. J. Heat and Mass Transfer 47 (10-11) 2293
• [5] Nadalini R and Bodendieck F 2006 Acta Astronautica 58 (11) 564
• [6] Cao Y and Faghri A 1994 Int. J. Heat and Mass Transfer 37 (10) 1525
• [7] Demidov A S and Yatsenko E S 1994 Int. J. Heat Mass Transfer 37 (14) 2155
• [8] Figus C, Bray Y Le, Bories S and Prat M 1999 Int. J. Heat Mass Transfer 42 (14) 2557 [9] Van Y H and Ochterbeck J M 2003 J. Electronic Packaging 125 (2) 251
• [10] Clair T J La and Mudawar I 2000 Int. J. Heat and Mass Transfer 43 (21) 3937
• [11] Patankar S 1980 Numerical Heat Transfer and Fluid Flow, Mcgraw-Hill, New York
• [12] Yang M and Tao W Q 1995 ASME J. Heat Transfer 117 619
• [13] Zhao T S and Liao Q 2000 Int. J. Heat and Mass Transfer 43 (7) 1141
• [14] Zhao T S, Cheng P and Wang C Y 2000 Chem. Engng Sci. 55 (14) 2653
• [15] Meyer M T, Mudawar I, Boyack Ch E and Hale Ch A (2006) Int. J. Heat and Mass Transfer 49 (1-2) 17