Mechanical modelling of thin films. Stress Evolution, Degradation, Characterization

Białas, M.

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Mechanical modelling of thin films. Stress Evolution, Degradation, Characterization

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Białas M.

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IPPT_Reports_2012_1_M_Bialas_online_23_May_2012.pdf

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Mechaniczne modelowanie cienkich warstw

Języki publikacji

Abstrakty

The thesis reports the research effort aimed at the mechanical modelling of thin films. It is devoted to four particular aspects: stress development due to mechanical and thermal loadings, coating degradation due to through thickness cracking, coating delamination and, finally, mechanical characterization of thin films using non-invasive methods. The monograph consists of seven chapters. Chapter 1 is an introductory chapter, where thin films deposition methods are described. Then, failure modes observed in coatings are discussed. Since the developed modelling tools will be applied in particular to thermal barrier coatings and human skin, two final sections of the chapter introduce the reader into mechanical and material properties of TBC systems and human skin. Mathematical preliminaries is the subject of Chapter 2 of the monograph. Basics of elastic fracture mechanics of interfacial cracks are briefly presented and cohesive zone model is introduced. This model makes a basis for subsequent modelling of various types of cracks within coating systems. Chapters 3-6 report the novel part of the research and, except for the experiment described in the frst part of Chapter 4 (bending tests combined with acoustic emission technique), present an original contribution of the Author. In Chapter 3 an energy model of segmentation cracking with application to silicon oxide film is presented. Chapter 4 reports Fnite element simulation of stress development, delamination and through-thickness cracking in TBC systems. In Chapter 5 two dimensional model of frictional slip is presented and semi-analytical procedure providing delamination estimation is described. Chapter 6 presents a conceptual setup of piezoelectric sensors used for mechanical characteristic of human skin. The final Chapter 7 concludes the monograph and recapitulates the main achievements of the reported research.

Cienkie warstwy znajdują zastosowanie w wielu gałęziach techniki. Odnajdujemy je w układach scalonych, czyli w każdym komputerze. Tutaj przewodzenie ładunków elektrycznych jest w dużej mierze zależne od rodzaju powierzchni kontaktowych na granicy cienkich warstw materiałów o różnych własnościach elektrycznych i mechanicznych (Freund i Suresh [69], Lu i współpracownicy [128]). Kolejnym przykładem zastosowania cienkich warstw są pokrycia elementów turbin gazowych, na przykład ich łopatki (Evans i współpracownicy [62, 63]). Izolacja, wykonana z bardzo porowatej ceramiki o małej przewodności cieplnej, odgrywa tutaj istotną rolę, chroniąc właściwy materiał łopatki przed temperaturami znacznie przewyższającymi jego temperaturę topnienia oraz zapewniając ochronę przed czynnikami korozyjnymi. Wiąże się z tym istotny aspekt ekonomiczny, zastosowanie warstw izolacji termicznej pozwala bowiem na wydłużenie całkowitego okresu pracy turbiny oraz prowadzi do zwiększenia jej wydajności. Szczególnie materiały o zmieniających się właściwościach mechanicznych i termicznych po grubości pokrycia odgrywają coraz ważniejszą rolę w tego rodzaju zastosowaniach. Należy wymienić tutaj pokrycia wielowarstwowe (po angielsku multi-layered), gdzie zmiana cech mechanicznotermicznych jest skokowa po grubości oraz te, gdzie jest ona ciągła (Pindera i współpracownicy [161, 162]). Te drugie noszą raczej niefortunną w języku polskim nazwę materiałów gradientowych (po angielsku graded materials). Cienką warstwą jest także ludzka skóra, dlatego mechanika cienkich warstw znajduje także swoje zastosowanie w tych dziedzinach techniki lub nauki, których nazwa zaczyna się przedrostkiem bio- (Białas i Guzina [26]). W szczególności odgrywa rolę w diagnostyce komórek nowotworowych (w sensie mechanicznym są one sztywniejsze od komórek zdrowych) oraz przy produkcji sztucznej skóry (Wagner i współpracownicy [209]). Czas użytkowania elementów maszyn lub konstrukcji szczególnie narażonych na ścieranie w wyniku kontaktu z otoczeniem może być znacznie zwiększony właśnie poprzez zastosowanie na nich cienkich pokryć. Należy tutaj wymienić dyski komputerowe wykorzystujące zjawisko magnetyzmu lub sztuczne implanty bioder lub kolan (Freund i Suresh [69]). Niewielka grubość cienkich warstw odgrywa istotne znaczenie w innych gałęziach techniki. Polimerowe filmy wykorzystuje się przy produkcji laminowanych szyb - łączą one ze sobą elementy szklane (Ivanov [101], Muralidhar i współpracownicy [143]). Ten sam materiał, ale dodatkowo zbrojony włóknami, wykorzystuje się w budownictwie do wzmocnienia uszkodzonych elementów konstrukcyjnych (Cottone i Giambanco [50]). Pierwszym wnioskiem jaki nasuwa się po przejrzeniu powyższej listy jest stwierdzenie, że rolą cienkich warstw nie jest przenoszenie dużych obciążeń, powiedzielibyśmy, że nie pełnią one roli nośnej. W większości przypadków tak rzeczywiście jest, spełniają one jedynie zadanie ochronne. Mimo to, w wielu sytuacjach sam sposób ich produkcji powoduje wytworzenie dużych naprężeń początkowych, które w połączeniu z tymi, które wywołuje obciążona konstrukcja, mogą prowadzić do uszkodzenia warstwy. Najczęściej spotykane rodzaje uszkodzeń to pęknięcia po grubości lub odspajanie warstwy. Ich obecność może oznaczać całkowitą bezużyteczność elementu, który warstwa ma chronić. Konstrukcja, której rozmiar w jednym kierunku jest znacznie mniejszy niż w dwóch pozostałych to w mechanice konstrukcji płyta lub powłoka. Najważniejsza różnica, która pojawia się jednak, gdy mamy na myśli cienką warstwę polega na tym, że nie możemy tutaj pominąć materiału, który znajduje się pod nią i efektu, który on wywołuje. W wielu przypadkach nie jest nawet możliwe, aby wykonać eksperyment z samą cienką warstwą, a trudności związane są najczęściej z jej znikomą grubością. Chcąc modelować mechaniczne zachowanie się warstwy, wykorzystujemy pojęcie powierzchni kontaktowej, to jest powierzchni łączącej warstwę z podłożem. Dla tego obszaru definiujemy cechy mechaniczne, które oddają specyficzny charakter połączenia dwóch różnych materiałów warstwy i podłoża. Celem rozprawy jest opracowanie różnych metod mechanicznej analizy cienkich warstw ze szczególnym uwzględnieniem opisu stanu naprężenia, wywołanego nim rozwoju uszkodzeń (pękanie po grubości warstwy oraz jej odspajanie) oraz identyfikacji cech mechanicznych warstwy. Przyjęte modelowanie opiera się o mechanikę kontynualną ciała stałego i nie uwzględnia efektów wywołanych explicite analizą ziaren, dyslokacji lub wtrąceń obecnych w cienkim filmie. Typowy rząd grubości warstw omawianych w pracy to 0.5 žm - 2 mm. Jedynie proces pękania segmentacyjnego opisany w Rozdziale 3 dotyczy warstw znacznie cieńszych, o grubości 30-660 nm. Oryginalne aspekty prezentowanej rozprawy to: - zastosowanie energetycznego modelu pękania segmentacyjnego do opisu zjawisk zachodzących w warstwie tlenku krzemu na podłożu polimerowym; - wyjaśnienie wpływu naprężeń wstępnych na proces pękania segmentacyjnego w tym przypadku; - ilościowa analiza procesu rozwoju spękań po grubości warstwy izolacji termicznej; - wykazanie istotności wielkości kroku obciążenia w analizie metodą elementów skończonych procesu rozwoju dużej liczby nie połączonych ze sobą spękań; sformułowanie wskazówek praktycznych zezwalających na uniknięcie problemów ze zbieżnością obliczeń; - analiza głównych czynników decydujących o rozwoju stanu naprężenia w warstwach izolacji termicznej i podanie hipotetycznego scenariusza opisującego proces delaminacji tych warstw; - sformułowanie metody pozwalającej na pół-analityczne oszacowanie procesu dwuwymiarowego poślizgu ciernego warstwy na sztywnym podłożu; - wyprowadzenie prostych wzorów opisujących kształt strefy zdelaminowanej oraz proces delaminacji sztywnej warstwy ze sztywnego podłoża; - koncepcyjne sformułowanie zasad działania czujnika piezoelektrycznego pozwalającego na pomiar sprzężonych modułów sprężystych wielowarstwowego materiału; - sformułowanie praktycznych wskazówek służących zwiększeniu efektywności działania zaproponowanego czujnika.

Słowa kluczowe

thin films modelling of thin films

cienkie warstwy modelowanie cienkich warstw mechaniczna analiza cienkich warstw

Wydawca

Instytut Podstawowych Problemów Techniki PAN

Czasopismo

IPPT Reports on Fundamental Technological Research

Rocznik

2012

Tom

nr 1

Strony

3--238

Opis fizyczny

Bibliogr. 233 poz.

Twórcy

autor

Białas M.

Bibliografia

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