Joining heatsink composite materials to ceramics

• Autorzy: Pietrzak K. , Kaliński D.
• Języki publikacji: EN

Abstrakty

EN

The special kind of MMCs (carbon fibre or tungsten particle reinforced copper amrix composites) with a low coefficient of thermal expansion, a high thermal conductivity and thermal stability, can be used successfully in many industrial areas as e.g. heatsink in electronic packaging, electric contacts with high dimensional stability, substrates for high - power semiconductors with similar thermal expansion as silicon or ceramics. In order to make full use of the advantages of this kind of materials, it is necessary to joint it to ceramics. This paper presents the results of investigations concerning the soldering of carbon fibre - copper and tungsten particle - copper composites to Al2O3 ceramics using Sn-Pb-Ag and Au-Sn fillers. The morphology and the nature of the interface layer after bonding process between the composite, filler material and ceramic were examined by microstructure investigations - analysing the linear and surface distributions of the elements. The analysis the surface and linear distribution of elements in the composite to alumina ceramics joints has shown that the nature of this interface is rather diffusion type.

Słowa kluczowe

EN

heat sink; composite; ceramic; joining

PL

radiator; kompozyt; ceramika; łączenie

• Wydawca: Sieć Badawcza Łukasiewicz - Instytut Technologii Materiałów Elektronicznych
• Czasopismo: Materiały Elektroniczne
• Rocznik: 2002
• Tom: T. 30, nr 3
• Strony: 5--14
• Opis fizyczny: Bibliogr. 5 poz., rys.

Twórcy

autor

Pietrzak K.

autor

Kaliński D.

• Instytut Technologii Materiałów Elektronicznych, Ul. Wólczyńska 133 01-919 Warszawa,