Mechanism of the intermetallic phase / compound growth on the substrate

• Autorzy: Wołczyński W. , Guzik E. , Kopyciński D. , Senderowski C.
• Języki publikacji: EN

Abstrakty

EN

Purpose: An analytical model is provided in order to reveal the mechanism of the intermetallic multi-layer formation on a substrate. Thus, formations of the Al3Ni2 - Al3Ni intermetallic multi-layer on the Ni - substrate and Fe3Zn10 - FeZn10 - FeZn13 intermetallic multi-layer on the Fe (armco) multi-layer are considered. Design/methodology/approach: The intermetallic multi-layers are the products of the undercooled peritectic reactions as this results from the model. Back-diffusion and partitioning as the phenomena accompanying the peritectic reactions are employed to describe the sub-layers growth. Research limitations/implications: The model could be modified to describe the multi-layers formation under the metastable conditions. Practical implications: The modelled descriptions of the mechanism of multi-layer formation seems to be a good tool to control the technologies like: diffusion soldering / brazing or hot dip galvanizing into zinc bath. Originality/value: This is quite new model revealing the mechanism of the intermetallic multi-layer formation based on the original theory of solute redistribution after back-diffusion.

Słowa kluczowe

EN

modelling; materials design; intermetallic phases; multilayers; back-diffusion

PL

modelowanie; projektowanie materiałowe; faza międzymetaliczna; wielowarstwy; multiwarstwy; dyfuzja wsteczna

• Wydawca: International OCSCO World Press
• Czasopismo: Journal of Achievements in Materials and Manufacturing Engineering
• Rocznik: 2007
• Tom: Vol. 24, nr 1
• Strony: 324--327
• Opis fizyczny: Bibliogr. 13 poz., rys.

Twórcy

autor

Wołczyński W.

autor

Guzik E.

autor

Kopyciński D.

autor

Senderowski C.

• Institute of Metallurgy and Materials Science, ul. Reymonta 25, 30-059 Kraków, Poland,

Bibliografia

• [1] D. Duvall, W. Owczarski, D. Paulonis, TLP Bonding, A New Method for Joining Heat Resistant Alloys, Welding Journal 53 (1974) 203-214.
• [2] I. Tuah-Poku, M. Dollar, T. Massalski, A Study of the Transient Liquid Phase Bonding Process Applied to a Ag/Cu/Ag Sandwich Joint Metallurgical Transactions 19A, (1988) 575-586.
• [3] W. Wołczyński, E. Guzik, D. Kopyciński, T. Himemiya, J. Janczak-Rusch, Mass Transport during Diffusion Soldering or Brazing at the Constant Temperature, Proceedings of the 13th International Heat Transfer Conference, Sydney - 2006, MST-11, (CD-ROM).
• [4] S. Corbin, P. Lucier, Thermal Analysis of Isothermal Solidification Kinetics during TLP Sintering, Metallurgical and Materials Transactions 32 (2001) 971-978.
• [5] T. Studnitzky, R. Schmid-Fetzer, Phase Formation and Diffusion Soldering in Pt/In, Pd/In, Zr/Sn Thin Film System, Journal of Electronic Materials 23 (2003) 362-369.
• [6] G. Lopez, S. Sommadossi, W. Gust, E. Mittemeijer, P. Zięba, Kinetic Behavior in Diffusion Soldered Ni/Al Interconnection, Interface Science 10 (2002) 13-19.
• [7] W. Wołczyński, Back-diffusion Phenomenon during Crystal Growth by the Bridgman Method, Chapter 2., in, Modelling of Transport Phenomena in Crystal Growth, eds J.S. Szmyd, K. Suzuki, WIT Press, Southampton / Boston, 2000, 19-59.
• [8] D. Kopyciński, Solidification of Intermetallic Phases on the Iron and its Low- and High-carbon Alloys during Hot Dip Galvanizing. Monographs-AGH 149 (2006) 131 (in Polish).
• [9] H. Woźnica, M. Michalik, Kinetics of Growth of the Zinc Coating on a Cast Iron during Hot Dip Galvanizing, Corrosion Protection 11 (2002) 157-162 (in Polish).
• [10] S. Divinski, F. Hisker, C. Herzig, R.Filipek, M.Danielewski, Self- and Interdiffusion in Ternary Cu-Fe-Ni Alloys, Defect and Diffusion Forum 237-240 (2005) 50-61.
• [11] I. Belova, G. Murch, R. Filipek, M. Danielewski, Theoretical Analysis of Experimental Tracer and Interdiffusion Data in Cu-Ni-Fe Alloys, Acta Materialia 53 (2005) 4613-4622.
• [12] R. Filipek, Modeling of Interdiffusion and Reactions at the Boundary, Initial-value Problem of Interdiffusion in the Open System, Defect and Diffusion Forum 237-240 (2005) 250-260.
• [13] W. Wołczyński, T. Wierzchoń, Formation Sequence of the Intermetallic Phases within Multi-layer Coatings, Materials Engineering 153 (2006) 1268-1271.