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Severely deformed Cu by using compression with oscillatory torsion method

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Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Konferencja
12th International Scientific Conference CAM3S'2006, 27-30th November 2006, Gliwice-Zakopane
Języki publikacji
EN
Abstrakty
EN
Purpose: The present study is aimed at a quantitative description of microstructural parameters as a misorientation angle of Cu deformed by using compression with oscillatory torsion. Design/methodology/approach: Cu samples were deformed at torsion frequency (f) changed from 0 Hz (compression only) to 1.8 Hz under a constant torsion angle (alpha) = 8 degrees and compression speed (v)=0.1 mm/s. Structural investigations were conducted by using transmission electron microscopy (TEM). Local misorientation have been measured by the Kikuchy pattern technique. Findings: The results of the investigations have shown that formation of ultrafine structure is seen after deformation at 0.4 Hz, where cells show broad boundaries having a diffuse dislocation arrangement, which transform to high-angle grain boundaries at higher strains (higher value of f). The subgrain interiors also contain dislocation arranged in an irregular shape. For this reason the effects must be explained by movements of dislocation, where dislocation are continuously built up to new boundaries as a deformation increase. Research limitations/implications: Reported research ought to be completed with EBSD (Electron Backsscattering Difraction) technique. Originality/value: Grain boundary misorientation is important for describing the microstructure of severe plastic deformation process and may be useful in explanation of ultrafine grains formation.
Rocznik
Strony
179--182
Opis fizyczny
Bibliogr. 15 poz., fot., rys.
Twórcy
autor
  • Department of Materials Science, Silesian Univeristy of Technology ul. Krasińskiego 8, 40-019 Katowice, Poland, kinga.rodak@polsl.pl
Bibliografia
  • [1] W.H. Huang, C.Y. Yu, P.W. Kao, C.P. Chang, The effect of strain path and temperature on the microstructure developed in copper processed by ECAE, Materials Science and Engineering A366 (2004) 221-228.
  • [2] G. Sakai, Z. Horita, T.G. Langdon, Grain refinement and superplasticity in aluminum alloy processed by high-pressure torsion, Materials Science and Engineering A 393 (2005) 344-351.
  • [3] K. Hyoung Seop, S. Min Hong, H. Sun Ig, Plastic deformation analysis of metals during equal channel angular pressing, Journal of Materials Processing Technology 113 (2001) 622-626.
  • [4] M. Greger, R. Kocich, L. Cizek, LA. Dobrzański, M. Widomska, B. Buretowa, A. Silbernagel, The structure and рroperties of chosen metals after ECAP, Journal of Achievements in Materials and Manufacturing Engineering, 18 (2006) 103-106.
  • [5] U. Chakkingal, P. F. Thomson, Development of microstructure and texture during high temperature equal channel angular extrusion of aluminium, Journal of Materials Processing Technology 117 (2001) 169-177.
  • [6] Y. Iwahashi, Z. Horita, M. Nemoto, T.G. Langdon, An investigation of microstructural evolution during equal-channel angular pressing, Acta Materialia 11 (1997) – 4733-4741.
  • [7] N.Hansen, X.Huang, R. Ueji, N. Tsuji, Structure and strength after large strain deformation, Materials Science and Engineering A387-389 (2004) 191-194.
  • [8] G. Sakai, Z. Horita, T.G. Langdon, Grain refinement and superplasticity in aluminum alloy processed by high-pressure torsion, Materials Science and Engineering A393 (2005) 344-351.
  • [9] J. Pawlicki, F.Grosman, The unconventional methods of plastic deformation of metallic materials. Proceedings of the international Conference "Forming 2004", Strbske Pleso-Vysoke Tatry, 2004, 198-203 (in Polish).
  • [10] G. Niewielski, D. Kuc, K. Rodak, F. Grosman. J. Pawlicki, Influence of strain on the copper structure under controlled deformation path conditions, Journal of Achievements in Materials and Manufacturing Engineering 17 (2006) 109-112.
  • [11] M. Richert, H.J. McQueen, J. Richert, Microband formation in cyclic extrusion compression of aluminium, Canadian Metallurgical Quarterly 5 (1998) 449-457.
  • [12] K.J. Kurzydłowski, M. Richert, On the mechanism of nanograins formation in cold-plastic deformation сonditions, Materials Engineering 4 (2005) 189-193.
  • [13] H. Ni, A.T. Alpas, Sub-micrometer structures generated during dry machining of copper, Materials Science and Engineering A361 (2003) 338-349.
  • [14] J.Y.Huang, Y.T.Zhu, H.Jiang, T.C. Lowe, Microstructures and dislocation configurations in nanostructured Cu processed by repetitive corrugation and straightening, Acta Materialia 49 (2001) 1497-1505.
  • [15] K. Rodak, The effect of oscillatory compression.test on the Cu microstructure form, Archives of Materials Science 27 (2006) 29-35.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS5-0018-0034
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