Photochemical machining of engineering materials

• Autorzy: Cakir O.
• Języki publikacji: EN

Abstrakty

EN

Photochemical machining (PCM) is one of the important nontraditional machining processes in which photographic and chemical etching techniques are employed. The workpiece material is shaped by using a strong chemical solution to dissolve surface of the workpiece that was selectively exposed to machine areas using a photographic technique. The application of photochemical machining has increased extensively in the electronics, precision engineering, medical and decorative industries as well as in the microcomponentproduction industry. The present study is aimed to provide information on the application of PCM. The selection of etching parameters such as etchants for engineering materials, chemical additives into main etchants and etching temperature on the different machining outputs will be discussed. Also, the influences of environmental legislations on the machining process are examined and the future directions are considered.

Słowa kluczowe

EN

photochemical machining; etchants; etching parameters; engineering material

PL

obróbka fotochemiczna; wytrawianie; parametry wytrawiania; materiał inżynierski

• Wydawca: Komitet Nauki o Materiałach PAN
• Czasopismo: Archives of Materials Science
• Rocznik: 2007
• Tom: Vol. 28, nr 1-4
• Strony: 15--19
• Opis fizyczny: Bibliogr. 22 poz., rys.

Twórcy

autor

Cakir O.

• Department of Mechanical Engineering, Dicle University, 21280 Diyarbakýr, Turkey,

Bibliografia

• [1] D.M. Allen, The Principles and Practice of Photochemical Machining and Photoetching, Adam Hilger, Institute Of Physics, Bristol, 1986.
• [2] H. Friedman, Photo-Chemical Machining - The best kept secret in American industry, Proceedings of the Non-Traditional Machining Conference, Orlando, 1988, 817-819.
• [3] W.T. Harris, Chemical Machining, The Technology of Cutting Materials by Etching, Clarendon Press, Oxford, 1976.
• [4] D. Gunter, Photochemical Machining, Machining Source Book, ASM International, Metal Park, Ohio, 1988, 475-478.
• [5] H. Friedman, Photocemical Machining, ASM Metals Handbook, 16 Machining, ASM International, Metal Park, Ohio, 1989, 587-593.
• [6] R. Snoeys, F. Staelens, W. Dekeyser, Current trends in non-conventional material removal processes, Annals of the CIRP 35/2 (1986) 467-480.
• [7] O. Cakir, A. Yardimeden, T. Ozben, Chemical machining, Archives of Materials Science and Engineering 28/8 (2007) 499-502.
• [8] O. Cakir, Copper etching with cupric chloride and regeneration of waste etchant, Journal of Materials Processing Technology 175/1-3 (2005) 63-68.
• [9] O. Cakir, Review of Etchants for Copper and Its alloys in Wet Etching Processes, Optics Design and Precision Manufacturing Technologies, Key Engineering Materials 364-366 (2008) 837-842.
• [10] D.M. Allen, Etching of iron with ferric chloride solution as a Model for a Technical and Economic Comparison of Three Spent Etchant regeneration Systems, Proceedings of the International Conference “Processing and Manufacturing of Advanced Materials” THERMEC’91, 1, 1991, 69-75.
• [11] D.M. Allen, H.J.A. White (Almond), Chlorine regeneration of ferric chloride solutions used for photochemical machining of iron, Proceedings of the International Conference “Processing and Manufacturing of Advanced Materials” THERMEC’92, 2, 1992, 19-24.
• [12] O. Cakir, Chemical etching of XCrNi1810 stainless steel, Proceedings of the 9th International Research/Expert Conference “Trends in the Development of Machinery and Associated Technology” TMT 2005, Antalya, 2005, 789-792.
• [13] O. Cakir, Study of Etch Rate and Surface Roughness in Chemical Etching of Stainless Steel, Optics Design and Precision Manufacturing Technologies, Key Engineering Materials 364-366 (2008) 460-465.
• [14] O. Cakir, Chemical etching of aluminium, Journal of Materials Processing Technology 199 (2008) 337-340.
• [15] D.M. Allen, O. Cakir, Copper Etching Economics, Photo Chemical Machining Institute Journal 52/4-7 (1993).
• [16] O. Cakir, Photochemical machining of copper and copper alloys, Proceedings of the 3rd International Conference “Advanced Manufacturing. Technology” ICAMT 2004, Malaysia, 2004, 60-64.
• [17] D.M. Allen, O. Cakir, Comparison of FeCl3 and CuCl2 etchants in the photochemical machining of brass, Proceedings of the 6th Biennial Conference on Engineering Systems Design and Analysis ESDA 2002, Turkey, 7, 2002.
• [18] D.M. Allen, O. Cakir, H.J.A. White (Almond), The photochemical machining of brass with cupric chloride etchant and a technique for the partial recovery of dissolved zinc, Proceedings of the Symposium High Rate Metal Dissolution Processes, 1995, 305-315.
• [19] O. Cakir, H. Temel, M. Kiyak, Chemical etching of Cu-ETP copper, Journal of Materials Processing Technology 162- 163 (2005) 275-279.
• [20] D.M. Allen, Progress towards clean technology for photochemical machining, Annals of the CIRP 42 (1993) 197-200.
• [21] D.M. Allen, The state of the art of photochemical machining at the start of the twenty-first century, Proceedings of the Institution of Mechanical Engineers. Part B. Journal of Engineering Manufacture 217 (2003) 643-650.
• [22] D.M. Allen, Photochemical Machining: from "Manufacturing's best kept secret" to a $6 billion per annum, rapid manufacturing process, Annals of the CIRP 53 (2004) 559-572.