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Dispersion - strengthened nanocrystalline copper

Wybrane pełne teksty z tego czasopisma
Identyfikatory
Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Purpose: The aim of this work was to investigate microstructure, mechanical properties and deformation behaviour of dispersion strengthened nanocrystalline copper produced by powder metallurgy techniques. Design/methodology/approach: Tests were performed with the Cu, Cu-tungsten carbide and Cu-yttria micro-composites containing up to 3 wt.% of a strengthening particles. The mechanical properties, initial nanocrystalline structures and their evolution during deformation processes were investigated. Findings: The obtained strengthening effect have been discussed based on the existing theories related to strengthening of nanocrystalline materials. The studies-have shown the importance of "flows" existing in the consolidated materials and sintered materials such as pores or regions of poor powder particle joining which significantly deteriorate mechanical properties of micro-composites produced by powder metallurgy. Research limitations/implications: The powder metallurgy techniques make it possible to obtain copper-based bulk materials by means of milling input powders in the planetary ball, followed by compacting and sintering. Additional operations of hot extrusion are also often used. There is some threat, however, that during high-temperature processing or using these materials at elevated or high temperatures this nanometric structure may become unstable. Practical implications: A growing trend to use new copper-based functional materials is observed recently world-wide. Within this group of materials particular attention is drawn to those with nanometric grain size of a copper matrix, which exhibit higher mechanical properties than microcrystalline copper. Originality/value: The paper contributes to the mechanical properties of dispersion strengthened (with tungsten carbide and yttria) nanocrystalline copper and to the elucidation of deformation behaviour of these materials with high porosity.
Rocznik
Strony
35--42
Opis fizyczny
Bibliogr. 15 poz., fot., rys., tab.
Twórcy
  • Division of Materials Processing Technology, Management and Computer Techniques in Materials Science, Institute of Engineering Materials and Biomaterials, Silesian University of Technology, ul. Konarskiego 18 a, 44-100 Gliwice, Poland, jerzys@amme.com
Bibliografia
  • [1] J. P. Stobrawa, Z. M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Proceedings of the 11th International Scientific Conference on Contemporary Achievement in Mechanics, Manufacturing and Materials Science, CAM3S'2005, Gliwice-Zakopane, 2005, 909-914.
  • [2] J.P. Stobrawa, Z.M. Rdzawski, Formation of a stable nanostructure in the copper-based materials, Journal of Materials Processing Technology (2007), (in Press).
  • [3] V. Rajkovic, at al., Copper matrix strengthening in Cu Al203 system by mechanical alloying and milling of pure copper and prealloyed copper powders. Advanced Science and Technology of Sintering (1988) 537-543.
  • [4] D.Y. Ying, D.L. Zhang, D.Y, Processing of Cu-Al203 metal matrix nanocomposite materials by using high energy bal milling, Materials Science and Engineering 1 (2000) 152-156.
  • [5] A. Zuniga, Microstructure and mechanical behavior of Cu based composites reinforced with WC and TiC particles, prepared by spray forming, Proceedings of the Second International Latin American Conference on Powder Technology, Iquacu, Brasil, 1999.
  • [6] N. Wang at al., Effect of grain size on mechanical properties of nanocrystalline materials, Acta Metallurgica et Materialia 2c (1995) 519-528.
  • [7] Y.J. Li, X.H. Zeng, W. Blum, Transition from strengthening to softening by grain boundaries in ultrafine-grained Cu, Acta Materialia 52 (2004) 5009-5018.
  • [8] R. Suryanarayanan at. al., Plastic deformation of nanocrystalline Cu and Cu-0,2 wt.% B, Materials Science and Engineering A 264 (1999) 210-214.
  • [9] H. Conrad, Grain size dependence of the plastic deformation kinetics in Cu, Materials Science and Engineering A 341 (2003) 216-228.
  • [10] K.S. Kumar, H. Van Swygenhoven, S. Suresh, Mechanical behaviour of nanocrystalline metals and alloys, Acta Materialia 51 (2003) 5743-5774.
  • [11] J. Stobrawa, Z. Rdzawski, Deformation behaviour of dispersion hardened nanocrystalline copper, Journal of Achievements in Materials and Manufacturing Engineering 17 (2006) 153-156.
  • [12] J.P. Stobrawa, Z.M. Rdzawski, Characterization of nanostructured copper - WC materiale, International Journal of Materials and Product Technology (2007), (in press).
  • [13] S.H. Yoo, T.S. Sudarshan, K. Sethuram, at al., Nano Structured Materials 12 (1999) 23-28.
  • [14] D.V. Kudashov at. al., Microstructure and room temperature hardening of ultra-fine-grained oxide-dispersion strengthened copper prepared by cryomilling, Materials Science and Engineering A 387-379 (2004) 768-771.
  • [15] U.F. Kocks, The theory of an abstacle-controlled yield strength, Materials Science and Engineering 27(1977) 198-291.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS3-0017-0091
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