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Application of DLC layers in 3-omega thermal conductivity method

Wybrane pełne teksty z tego czasopisma
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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
Purpose: The 3-omega method is a unique measuring technique which can be applied for thermal conductivity measurements of bulk materials and layers. In order to measure thermal conductivity of semiconducting and metallic materials (e.g. thermoelectric materials) it is necessary to separate the sensor from the substrate by a dielectric layer. The layer should exhibit thermal conductivity .s comparable or greater than thermal conductivity of characterised materials, as well as good, electrically insulating properties. Design/methodology/approach: The DLC layers were prepared via the magnetron sputtering technique. The reactive sputtering process was carried out in the mixture of Ar and methane (CH4) work gases at the pressure ranging from 0.3 to 0.7 Pa. The layers were deposited on glass and selected thermoelectric materials. The temperature of substrate was controlled in range from 35 oC to 500 oC depending on type of the substrate material. The thickness of received DLC layers was in range from 0.2 to 2 žm. Findings: In order to estimate the accuracy of the modified 3-omega method thermal conductivity measurement results were compared to results of measurements without additional DLC layers and independent data obtained by the laser-flash method. Analysis of experimental results of test measurements show that application of 300 nm thick DLC insulating films allow for characterization of materials exhibiting . < 1.2Wm-1K-1 with the accuracy better than 9%. Research limitations/implications: Results of investigations indicate that prepared DLC layers satisfy requirements of 3-omega method and do not influence significantly on precision and accuracy of thermal conductivity measurements. Originality/value: We have developed the new method of preparation of diamond-like carbon (DLC) layers which satisfy requirements of the 3-omega technique. The layers can be applied for thermal properties measurements of selected thermoelectric materials.
Rocznik
Strony
512--517
Opis fizyczny
Bibliogr. 15 poz., rys., tabl.
Twórcy
autor
autor
  • Department of Inorganic Chemistry, Faculty of Materials Science and Ceramics, AGH University of Science and Technology, Al. Mickiewicza 30, 30-059 Kraków, Poland, wojciech@agh.edu.pl
Bibliografia
  • [1] D. G. Cahill, R. O. Pohl, Thermal conductivity of amorphous solids above the plateau, Physical. Review B 35/8 (1987) 4067-4073.
  • [2] D. G. Cahill, Thermal conductivity of thin films: measurements and understanding, Journal of Vacuum Science and Technology A 7/3 (1989) 1259-1266.
  • [3] D. G. Cahill, Thermal conductivity measurement from 30 to 750 K: the 3omega method, Review of Scientific Instruments 61/2 (1990) 802-808.
  • [4] S. Lee, S.-Il. Kwun, Heat capacity measurement of dielectric solids using a linear surface heater: application to ferroelectrics, Review of Scientific Instruments 65 (1994) 966-970.
  • [5] B. W. Olson, S. Graham, K. Chen, A practical extension of the 3omega method to multilayer structures, Review of Scientific Instruments 76/5 (2005) 1-7.
  • [6] A. Kusiak, J.-L. Battaglia, S. Gomez, J.-P. Manaud, Y. Lepetitcorps, CuO thin films thermal conductivity and interfacial thermal resistance estimation, European Physical Journal - Applied Physics 35/1 (2006) 17-27.
  • [7] J. Alvarez-Quintana, J. Rodriguez-Viejo, Extension of the 3-omega method to measure the thermal conductivity of thin films without a reference sample, Sensors Actuators A 142 (2008) 232-236.
  • [8] J.-L. Battagliaa,C. Wiemerb, M. Fanciulli, An accurate low-frequency model for the 3omega method, Journal of Applied Physics 101/10 (2007) 104510.
  • [9] K. T. Wojciechowski, R. Mania, K Mars, R. Zybała, Application of the 3ω method for thermal conductivity measurement of bulk materials and layers, Electronics 48/10 (2007) 61-63 (in Polish).
  • [10] K. T. Wojciechowski, R. Zybała, R. Mania, K. Mars, The 3-omega method for thermal conductivity measurements of thermoelectric materials, Proceedings of the 5th European Conference “Thermoelectrics”, Odessa, Ukraine, 2007, 191-195.
  • [11] R. Zybała, K. T. Wojciechowski, W. Kucza, R. Gajerski, E. Godlewska, R. Mania, Characterization of thermal properties of protective layers by the 3-omega method, Electronics - Constructions, Technologies, Applications 9 (2009) 22-24.
  • [12] S. Shin, H. N. Cho, B. S. Kim, H. H. Cho, Influence of upper layer on measuring thermal conductivity of multilayer thin films using differential 3-ω method, Thin Solid Films 517 (2008) 933-936.
  • [13] M, Seeichi, T. Takayuki, Thermal Properties of DLC Film, Thermophys Prop 26 (2005) 35-37 (in Japanese).
  • [14] S. Mina, J. Blumm, A. Lindemann, A new laser flash system for measurement of the thermophysical properties, Thermochimica Acta 455 (2007) 46-49.
  • [15] P. Schoderböck, H. Klocker, L. S. Sigl, G. Seeber, Evaluation of the Thermal Diffusivity of Thin Specimens from Laser Flash Data, International Journal of Thermophysics 30 (2009) 599–607.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS2-0021-0053
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