Obróbka ultraprecyzyjna i nanoobróbka na tle dynamicznego rozwoju nanotechnologii.

• Autorzy: Oczoś K. E.

Warianty tytułu

EN

Ultraprecision machining and nanometric machining against a backgroung of dynamic development of nanotechnology.

• Języki publikacji: PL

Abstrakty

PL

Rys historyczny rozwoju nanotechnologii. Pojęcia związane z nanotechnologią. Obróbka ultraprecyzyjna i nanoobróbka różnych materiałów. Obrabiarki do obróbka ultraprecyzyjnej. Symulacja mechanizmu nanoskrawania w oparciu o dynamikę molekularną. Przyszłość nanotechnologii.

EN

Historical background of development of nanotechnology. Definitions of nanotechnology. Ultraprecision machining and nanometric machining of various materials. Ultraprecision machine tools. Molecular dynamics simulation of nanometric cutting. Future for nanotechnology.

Słowa kluczowe

PL

obróbka ultraprecyzyjna; nanoobróbka; nanotechnologia

EN

ultraprecision machining; nanometric machining; nanotechnology

• Wydawca: Stowarzyszenie Inżynierów i Techników Mechaników Polskich
• Czasopismo: Mechanik
• Rocznik: 2001
• Tom: R. 74, nr 5-6
• Strony: 307--315
• Opis fizyczny: Bibliogr. 30 poz., rys.

Twórcy

autor

Oczoś K. E.

• Politechnika Rzeszowska

Bibliografia

• 1. J. Corbett, P.A. McKeown, G. N. Peggs, R. Whatmore: Nanotechnology: International developments and emerging products. Ann. CIRP, 49(2000)2, 523-545.
• 2. K.E. Oczoś: Nanotechnologia - ultraprecyzyjne procesy technologiczne. Mechanik, 68(1995)5/6, 165-172.
• 3. J.A. Kozubowski: Perspektywy nanotechnologii. Wiedza i Życie, nr 10, 1998, 24-30.
• 4. C. Cempel: Nanonauka - Nanotechnologia. źródła i perspektywy. Nauka, nr 3, 1999, 178-186.
• 5. K.E. Drexler: Engines of creation: The coming era of nanotechnology. Anchor Press/Doubleday, New York 1986.
• 6. K.E. Drexler: Nanosystems: Molecular machinery, manufacturing and computation. J. Wiley & Sons, New York 1992.
• 7. A. Majumdar: Eye on the future: Nanotechnology. Mechanical Engineering, 123(2001)3, 46-49.
• 8. N. Taniguchi: Nanotechnology - Integrated processing systems for ultra precision and ultra fine products. Oxford University Press, 1996.
• 9. Prospekty firmy Nanotechnology Systems. LLC (Keene, NH, USA).
• 10. Y. Takeuchi, Y. Sakaida, K. Sawada, T. Sata: Development of a 5-axis control ultraprecision milling machine for micromachining based on non-friction serwomechanisms. Ann. CIRP, 49(2000)1, 295-297.
• 11. W.S. Blackley, R.O. Scattergood: Ductile - regime machining model for diamond turning of brittle materials. Precision Engineering, 13(1991)2, 95-103.
• 12. K.E. Oczoś: Kształtowanie ceramicznych materiałów technicznych. Oficyna Wydawnicza Politechniki Rzeszowskiej, Rzeszów 1996.
• 13. Wei Gao, R.J. Hocken, J.A. Patten, J. Lovingood: Experiments using a nanomachining instrument for nano-cutting brittle materials. Ann. CIRP, 49(2000)1, 439-442.
• 14. F. Klocke, O. Rubenach: Spanen mit geometrisch bestimmter Schneide. Perfekt in Form gebracht. Schweizer Maschinenmarkt, Nr 39, 1998, 48, 49, 51.
• 15. E. Shamoto, C. Ma, T. Moriwaki: Ultraprecision ductile cutting of glass by applying ultrasonic elliptical vibration cutting. Precision Engineering - Nanotechnology. Proc. 1st Inter, euspen Conf., Shaker Verlag, Aachen 1999, vol. 1, 408-411.
• 16. M.S. Daw, M.I. Baskes: Embedded atom method: Derivation and application to impurities, surfaces, and other defects in metals. Physical Review, 29(1984)12, 6443-6453.
• 17. J. Belak, I. Stowers: A molecular dynamics model of the orthogonal cutting process. Proc. ASPE Annual Conf., Rochester, NY, USA, 1990.
• 18. N. Ikawa, S. Shimada, K. Tanaka, G. Ohmori: An atomistic analysis of nanometric chip removal as affected by tool-work interaction in diamond turning. Ann. CIRP, 40(1991)1, 551-554.
• 19. N. Ikawa, R.R. Donaldson, R. Komanduri, W. König, P.A. McKeown, T. Moriwaki, I.F. Stowers: Ultraprecision metal cutting - the past, the present, and the future. Ann. CIRP, 40(1991)2, 587-594.
• 20. T. Inamura, N. Takezawa, Y. Kumaki: Mechanics and energy dissipation in nanoscale cutting. Ann. CIRP, 42(1993)1, 79-82.
• 21. S. Shimada, N. Ikawa, H. Tanaka, J. Uchikoshi: Structure of micromachined surface simulated by molecular dynamics analysis. Ann. CIRP, 43(1994)1, 51-54.
• 22. V.C. Venkatesh, I. Inasaki, H.K. Tönshoff, T. Nakagawa, I.D. Marinescu: Observations on polishing and ultraprecision machining of semiconductor substrate materials. Ann. CIRP, 44(1995)2, 611-618.
• 23. Jeong-Du Kim, Cham-Hong Moon: A study on the cutting mechanism of microcutting using molecular dynamics. Int. J. Adv. Manuf. Technol., 11(1996)5, 319-324.
• 24. R. Rentsch, I. Inasaki: Investigation of surface integrity by molecular dynamics simulation for abrasive processes. Ann. CIRP, 44(1995)1, 295-298.
• 25. N. Chandrasekaran, A. Noori-Khajavi, L.M. Raff, R. Komanduri: A new method for molecular dynamics simulation of nanometric cutting. Philo. Mag. B., 77(1998)1, 7.
• 26. R. Komanduri, N. Chandrasekaran, L.M. Raff: Effect of tool geometry in nanometric cutting: An M.D. simulation approach. Wear, 219(1998)1, 84-97.
• 27. R. Komanduri, N. Chandrasekaran, L.M. Raff: Orientation effects in nanometric cutting of single cristal materials: An M.D. simulation approach. Ann. CIRP, 48(1999)1, 67-72.
• 28. R. Komanduri, N. Chandrasekaran, L.M. Raff: M.D. simulation of nanometric cutting of single cristal aluminium - effect of crystal orientation and direction of cutting. Wear, 242(2000)1/2, 60-88.
• 29. K.E. Oczoś: Obróbka ultraprecyzyjna. Mechanik, 64(1991)8/9, 273-280.
• 30. K.E. Oczoś: Kształtowanie mikroczęści - charakterystyka sposobów mikroobróbki i ich zastosowanie. Mechanik, 72(1999)5/6, 309-324, 327.