Tytuł artykułu
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Warianty tytułu
Konferencja
XV Physical Metallurgy and Materials Science Conference on Advanced Materials & Technologies AMT'98, Kraków-Krynica, Poland, 17-21 May, 1998
Języki publikacji
Abstrakty
Electrical properties as well as the structure and morphology of multilayered Cu/Ni films deposited by magnetron sputtering were investigated. The influence of the deposition and annealing parameters on the temperature coefficient of resistance (TCR) and sample resistivity were determined. Using TEM images the dependence of the grain size of crystalline films on the sublayer Cu and Ni thickness and annealing temperature was investigated.
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Czasopismo
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Tom
Strony
840--843
Opis fizyczny
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autor
autor
autor
- Department of Electronics, University of Mining and Metallurgy, Al. Mickiewicza 30, 30-059 Kraków, Poland [Wydział Elektroniki, Akademia Gorniczo-Hutnicza]
Bibliografia
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS1-0006-0080