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Tytuł artykułu
Autorzy
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Warianty tytułu
Konferencja
XV Physical Metallurgy and Materials Science Conference on Advanced Materials & Technologies AMT'98, Kraków-Krynica, Poland, 17-21 May, 1998
Języki publikacji
Abstrakty
Electrical properties as well as the structure and morphology of multilayered Cu/Ni films deposited by magnetron sputtering were investigated. The influence of the deposition and annealing parameters on the temperature coefficient of resistance (TCR) and sample resistivity were determined. Using TEM images the dependence of the grain size of crystalline films on the sublayer Cu and Ni thickness and annealing temperature was investigated.
Słowa kluczowe
Wydawca
Czasopismo
Rocznik
Tom
Strony
840--843
Opis fizyczny
Bibliogr. 6 poz., rys.
Twórcy
autor
- Departament of Electronics, University of Mining and Metallurgy, Kraków, Poland
autor
- Departament of Electronics, University of Mining and Metallurgy, Kraków, Poland
autor
- Departament of Metallography, University of Mining and Metallurgy, Kraków, Poland
- Department of Electronics, University of Mining and Metallurgy, Al. Mickiewicza 30, 30-059 Kraków, Poland [Wydział Elektroniki, Akademia Gorniczo-Hutnicza]
Bibliografia
- [1] J.E.Hillard, in A.I.P. Conf. Proc. No53, Modulated Structures, edited by J.M.Cowley, J.B.Cohen, M.B.Salamon and B.J.Wuensch, 407 (1979)
- [2] L.H.Bennet and R.E.Watson (ed), „Magnetic Multilayers” World Scientific, Singapore 1993.
- [3] J. Dora, Polish Patent Application P-313150 (1996)
- [4] C.Worek, Doctorial Dissertation (in preparation)
- [5] P.F.Carcia and A.Suna, J.Appl.Phys., 54 (1983) 2000
- [6] G.T.Meaden, „Electrical Resistance of Metals”, Heywood Books, London 1966.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BOS1-0006-0080