Electrical properties and transmission electron microscopy study on sputtered Cu/Ni multilayer films.

• Autorzy: Worek C. , Jankowski H. , Ciura F.
• Konferencja: XV Physical Metallurgy and Materials Science Conference on Advanced Materials & Technologies AMT'98, Kraków-Krynica, Poland, 17-21 May, 1998
• Języki publikacji: EN

Abstrakty

EN

Electrical properties as well as the structure and morphology of multilayered Cu/Ni films deposited by magnetron sputtering were investigated. The influence of the deposition and annealing parameters on the temperature coefficient of resistance (TCR) and sample resistivity were determined. Using TEM images the dependence of the grain size of crystalline films on the sublayer Cu and Ni thickness and annealing temperature was investigated.

Słowa kluczowe

EN

transmission electron microscopy; electrical properties; thin film; multilayer; lattice; copper; nickel; sputtering; annealing; electrical resistivity

PL

mikroskopia elektronowa prześwietleniowa; własności elektryczne; cienka warstwa; powłoka wielowarstwowa; warstwa wielocząsteczkowa; sieć krystaliczna; miedź; nikiel; napylanie jonowe; wyżarzanie; opór właściwy

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Inżynieria Materiałowa
• Rocznik: 1998
• Tom: R. XIX, nr 4
• Strony: 840--843
• Opis fizyczny: Bibliogr. 6 poz., rys.

Twórcy

autor

Worek C.

• Departament of Electronics, University of Mining and Metallurgy, Kraków, Poland

autor

Jankowski H.

• Departament of Electronics, University of Mining and Metallurgy, Kraków, Poland

autor

Ciura F.

• Departament of Metallography, University of Mining and Metallurgy, Kraków, Poland

• Department of Electronics, University of Mining and Metallurgy, Al. Mickiewicza 30, 30-059 Kraków, Poland [Wydział Elektroniki, Akademia Gorniczo-Hutnicza]

Bibliografia

• [1] J.E.Hillard, in A.I.P. Conf. Proc. No53, Modulated Structures, edited by J.M.Cowley, J.B.Cohen, M.B.Salamon and B.J.Wuensch, 407 (1979)
• [2] L.H.Bennet and R.E.Watson (ed), „Magnetic Multilayers” World Scientific, Singapore 1993.
• [3] J. Dora, Polish Patent Application P-313150 (1996)
• [4] C.Worek, Doctorial Dissertation (in preparation)
• [5] P.F.Carcia and A.Suna, J.Appl.Phys., 54 (1983) 2000
• [6] G.T.Meaden, „Electrical Resistance of Metals”, Heywood Books, London 1966.