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Numerical simulation of heat transfer and two-phase flow in a novel heat pipe cold plate

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Wybrane pełne teksty z tego czasopisma
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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
To solve high heat flux cooling problems in case of modern electronic appliances, a novel heat pipe cold plate is designed and developed. The heat pipe cold plate is uniquely-different from normal thermosyphons, in which the acetone-aluminum heat pipe construction is composed of eight vertical heat pipe branches with their upper ends and lower ends connected with each other by two horizontal heat pipe branches, respectively, which make the working vapour and liquid flow smooth within the internal flow space of the heat pipe cold plate. In this paper, based on previous experimental and theoretical studies, a mathematical model for numerical simulations of the vapour-liquid two-phase flow and heat transfer phenomena in the heat pipe cold plate is presented. Two-fluid-model is employed to describe flow characteristics and phase interaction between vapour and liquid phases. Differential equations are solved by finite volume method and IPSA algorithm is employed to consider the vapour-liquid coupling effect. Effects of the total heating power and the cooling water flow rate on wall temperature distribution and two-phase flow heat transfer characteristics are numerically simulated. Computation results well agree with experimental results. The novel heat pipe cold plate possesses excellent heat transfer characteristics and temperature uniformity performance; it can provide a much better cooling solution for multi-heat-source and high heat-flux cooling problems than forced-convection cooling techniques. Also, numerical solution established and realized in this paper can be used as a reference.
Rocznik
Strony
45--62
Opis fizyczny
Bibliogr. 18 poz.,Rys., wykr., wz.,
Twórcy
autor
autor
  • Department of Power Engineering, School of Mechanical and Power Engineering, Jiangsu University of Science and Technology, No. 2, Mengxi Road, Zhenjiang City, Jiangsu Province, P.R. China
Bibliografia
  • 1. SAUCIUC B., ET AL.: Design and testing of the super fiber heat pipes for electronics cooling applications, Annual IEEE Semiconductor Thermal Measurement and Management Symposium, 2000, 27-32.
  • 2. NAMBA T.: Heat pipes for electronic devices cooling and evaluation of their thermal performance, Thermal Mechanical Phenomena in Electronic Systems, Proc. of the Int. Con. IEEE, 1998, 456-459.
  • 3. SATHE ETC.: Review of recent developments in some practical aspects of air-cooled electronic packages, J. of Heat Transfer, Trans. ASME, Vol. 120, 1998, 830-838.
  • 4. RYAN J.M., ROSHAN J., and SONG L.: Integrated thermal management techniques for high power electronic devices, Applied Thermal Engineering, Vol. 24, 2004, 1143-1156.
  • 5. ZUO Z.J., NORTH M.T., and WERT K.L.: High heat flux heat pipe mechanism for cooling of electronics, IEEE Trans, on Components and Packaging Technologies, 24(2), 2001, 220-225.
  • 6. ZHESHU MA: Experimental study and numerical simulation of the newly-designed heat pipe cold plate for electronics cooling applications, Nanjing University of Aeronautics and Astronautics, Nanjing, P.R. China, Doctoral Theses, 2004.
  • 7. ZHESHU MA, SHOUGUANG YAO: Experimental investigation on thermal performance of a novel heat pipe cold plate, Int. Journal of Heat & Technology, 2008(2).
  • 8. LAHEY R.: The analysis of phase separation and phase distribution phenomena using two-fluid models, J. Nucl. Engng. Des., 1990, 122(1), 17-25.
  • 9. ISHII., M.: Thermo-fluid Dynamic Theory of Two-phase Flow, Eyrolles Book Publishing House, 1975.
  • 10. SPALDING, D.B., MARKATOS, N.C.: Computer Simulation of Multi-Phase Flows ACFDU, Imperial College UK, A1983 G36-50.
  • 11. WANG, Y, VAFAI, K.: Transient characterization of flat plate heat pipe during startup and shut-down operation [J], Inter. J. of Heat and Mass Transfer, 2000, 43(15), 2641-2655.
  • 12. SHIRAISHI, M., KIKUCHI, K.: Investigation of heat transfer characteristics of two-phase closed thermosyphon, [in:] Advances in Heat Pipe Technology, 1981, 95-104.
  • 13. KAYA, T., GOLDAK, J.: Three-dimensional numerical analysis of heat and mass transfer in heat pipes, Heat and Mass Transfer, 2007, 43(8), 775-785.
  • 14. GHAJAR M., DARABI J.: Numerical modeling of evaporator surface temperature of a micro loop heat pipe at steady-state condition, J. of Micromechanics and Micromechanics, 2005, 15(10), 1963-1971.
  • 15. CHEN M.M., FAGHRI A.: An analysis of the vapor flow and the heat conduction through the liquid-wick and pipe wall in a heat pipe with single or multiple heat sources, Int. J. of Heat and Mass Transfer, 1990, 33(9), 1945-1955.
  • 16. SCHMALHOFER J., FAGHRI A.: A study of circumferentially heated and block-heated heat pipes-II. Three-dimensional modeling as a conjugate problem, Int. J. of Heat and Mass Transfer, 1993, 36(1), 213-226.
  • 17. ZHU N., VAFAI K.: Analysis of cylindrical heat pipes incorporating the effects of liquid-vapor coupling and non-Darcian transport-a closed form solution, Int. J. of Heat and Mass Transfer, 1999, 42(18), 3405-3418.
  • 18. CHERNYSHEVA M.A., MAYDANIK YU.F.: Numerical simulation of transient heat and mass transfer in a cylindrical evaporator of a loop heat pipe, Int. J. of Heat and Mass Transfer, 51(17-18), 2008, 4204-4215.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BGPK-2380-9118
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