Modeling, Simulation and Calibration of Silicon Wet Etching

• Autorzy: Kociubiński A. , Duk M. , Bieniek T. , Janus P.
• Języki publikacji: EN

Abstrakty

EN

The methods of parameter optimization in Etch3DTM simulator and the results of the comparison of simulations of silicon etching in KOH with experiments are presented. The aim of this study was to calibrate the tool to a set of process conditions that is offered by Institute of Electron Technology (ITE). The Taguchi approach was used to analyze the influence of every remove probability function (RPF) parameter on one or more output parameters. This allowed tuning the results of simulation to the results of real etching performed in ITE.

Słowa kluczowe

EN

anisotropic wet etching; KOH; silicon technology

• Wydawca: Instytut Łączności - Państwowy Instytut Badawczy
• Czasopismo: Journal of Telecommunications and Information Technology
• Rocznik: 2009
• Tom: nr 4
• Strony: 65--70
• Opis fizyczny: Bibliogr. 6 poz., rys., tab.

Twórcy

autor

Kociubiński A.

autor

Duk M.

autor

Bieniek T.

autor

Janus P.

• Lublin University of Technology, Nadbystrzycka st 38a, 20-618 Lublin, Poland,

Bibliografia

• [1] H. Seidel, L. Csepregi, A. Heuberger, and H. Baumgartel, “Anisotropic etching of crystalline silicon in alkaline solutions”, J. Electrochem. Soc., vol. 137, no. 11, pp. 3612–3625, 1990.
• [2] “Etch3D User Guide Version 2006.5”, Sept. 2006 [Online]. Available: http://www.coventor.com
• [3] M. A. Gosalvez, R. M. Nieminen, P. Kilpinen, E. Haimi, and V. Lindroos, “Atomistic wet chemical etching of crystalline silicon: atomistic Monte-Carlo simulations and experiments”, Appl. Surf. Sci., vol. 178, pp. 7–26, 2001.
• [4] P. J. Ross, Taguchi Techniques for Quality Engineering. New York: McGraw-Hill, 1988.
• [5] G. Z. Yin and D. W. Jillie, “Orthogonal design for process opti- mization and its application in plasma-etching”, Solid-State Technol., vol. 30, no. 5, pp. 127–132, 1987.
• [6] P. Janus, T. Bieniek, A Kociubiński, P. Grabiec, and G. Schropfer, “Modeling and co-simulation of integrated micro- and nanosystems”, in 14th Int. Conf. MIXDES 2007, Ciechocinek, Poland, 2007.