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Properties and benefits of fluorine in silicon and silicon-germanium devices

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Warianty tytułu
Języki publikacji
EN
Abstrakty
EN
This paper reviews the behaviour of fluorine in silicon and silicon-germanium devices. Fluorine is shown to have many beneficial effects in polysilicon emitter bipolar transistors, including higher values of gain, lower emitter resistance, lower 1/f noise and more ideal base characteristics. These results are explained by passivation of trapping states at the polysilicon/silicon interface and accelerated break-up of the interfacial oxide layer. Fluorine is also shown to be extremely effective at suppressing the diffusion of boron, completely suppressing boron transient enhanced diffusion and significantly reducing boron thermal diffusion. The boron thermal diffusion suppression correlates with the appearance of a fluorine peak on the SIMS profile at approximately half the projected range of the fluorine implant, which is attributed to vacancy- fluorine clusters. When applied to bipolar technology, fluorine implantation leads to a record fT of 110 GHz in a silicon bipolar transistor.
Rocznik
Tom
Strony
57--63
Opis fizyczny
Bibliogr. 21 poz., rys.
Twórcy
autor
  • School of Electronics & Computer Science, University of Southampton, Southhampton, SO17 1BJ, UK, pa@ecs.soton.ac.uk
Bibliografia
  • [1] R. G. Wilson, “Boron, fluorine and carrier profiles for B and BF2 implants into crystalline and amorphous Si”, J. Appl. Phys., vol. 54, pp. 6879–6889, 1983.
  • [2] D. F. Downey, J. W. Chow, E. Ishida, and K. S. Jones, “Effect of fluorine on the diffusion of boron in ion implanted silicon”, Appl. Phys. Lett., vol. 73, p. 1263, 1998.
  • [3] Y.-J. Park and J.-J. Kim, “Fluorine implantation effect on boron diffusion in silicon”, J. Appl. Phys., vol. 85, p. 803, 1999.
  • [4] N. E. Moiseiwitsch and P. Ashburn, “The benefits of fluorine in pnp polysilicon emitter bipolar transistors”, IEEE Trans. Electron Dev., vol. ED-41, pp. 1249–1255, 1994.
  • [5] J. F. W. Schiz and P. Ashburn, “Improved base current ideality in polysilicon emitter bipolar transistors due to fast fluorine diffusion through oxide”, Electron. Lett., vol. 35, pp. 752–753, 1999.
  • [6] N. Siabi-Shahrivar, W. Redman-White, P. Ashburn, and H. A. Kem- hadjian, “Reduction of 1/ f noise in polysilicon emitter bipolar tran- sistors”, Solid State Electron., vol. 38, pp. 389–400, 1995.
  • [7] N. Lukyanchikova, N. Garbar, M. Petrichuk, J. F. W. Schiz, and P. Ashburn, “The influence of BF2 and F implants on the 1/ f noise in SiGe HBTs with a self-aligned link base”, IEEE Trans. Electron Dev., vol. 48, no. 12, pp. 2808–2815, 2001.
  • [8] K. Ohyu, T. Itoga, and N. Natsuaki, “Advantages of fluorine introduction in boron implanted shallow pn junction formation”, Jpn. J. Appl. Phys., vol. 29, p. 457, 1990.
  • [9] H. A. W. El Mubarek and P. Ashburn, “Reduction of boron thermal diffusion and elimination of boron transient enhanced diffusion in silicon by high energy fluorine implantation”, Appl. Phys. Lett., vol. 83, no. 20, pp. 4134–4136, 2003.
  • [10] H. A. W. El Mubarek, M. Karunaratne, J. M. Bonar, G. D. Dilliway, Y. Wang, R. Price, J. Zhang, P. L. F. Hemment, A. F. Willoughby, P. Ward, and P. Ashburn, “Effect of fluorine implantation dose on boron thermal diffusion in silicon”, J. Appl. Phys., vol. 96, no. 8, pp. 4114–4121, 2004.
  • [11] H. A. W. El Mubarek and P. Ashburn, “Reduction of boron thermal diffusion and elimination of boron transient enhanced diffusion in silicon-germanium by high energy fluorine implantation”, IEEE Electron Dev. Lett., vol. 25, pp. 535–537, 2004.
  • [12] H. A. W. El Mubarek, M. Karunaratne, J. M. Bonar, G. D. Dilliway, Y. Wang, P. L. F. Hemment, A. F. Willoughby, and P. Ashburn, “Effect of fluorine implantation dose on boron transient enhanced diffusion and boron thermal diffusion in Si1−xGex”, IEEE Trans. Electron Dev., vol. 52, no. 4, pp. 518–526, 2005.
  • [13] K. Liu, J. Wu, J. Chen, and A. Jain, “Fluorine assisted super halo for sub-50 nm transistors”, IEEE Electron Dev. Lett., vol. 24, pp. 180–182, 2003.
  • [14] H. Fukutome, Y. Momiyama, H. Nakao, T. Aoyama, and H. Arimoto, “Fluorine implantation impact in extension region on the electrical performance of sub-50 nm p-MOSFETs”, Tech. Dig. Int. Electron Dev. Meet., Washington, USA, 2003, pp. 485–488.
  • [15] M. N. Kham, H. A. W. El Mubarek, J. M. Bonar, P. Ashburn, P. Ward, L. Fiore, R. Petralia, C. Alemanni, and A. Messina, “110 GHz fT silicon bipolar transistors implemented using fluorine implantation for boron diffusion suppression”, IEEE Trans. Electron Dev., vol. 53, no. 3, pp. 545–552, 2006.
  • [16] Y. Ono, M. Tabe, and Y. Sakakibara, “Segregation and defect termination of fluorine at Si02/Si”, Interf. Appl. Phys. Lett., vol. 62, p. 375, 1993.
  • [17] N. E. Moiseiwitsch, C. Marsh, P. Ashburn, and G. R. Booker, “Epitaxial regrowth of n+ polycrystalline silicon at 850◦C induced by fluorine implantation”, Appl. Phys. Lett., vol. 66, pp. 1918–1920, 1995.
  • [18] C. D. Marsh, N. E. Moiseiwitsch, G. R. Booker, and P. Ashburn, “Behaviour and effects of fluorine in annealed n+ polycrystalline silicon layers on silicon wafers”, J. Appl. Phys., vol. 87, pp. 7567–7578, 2000.
  • [19] G. R. Nash, J. F. W. Schiz, C. D. Marsh, P. Ashburn, and G. R. Booker, “Activation energy for fluorine transport in amorphous silicon”, Appl. Phys. Lett., vol. 75, pp. 3671–3673, 1999.
  • [20] S. R. Sheng, W. R. McKinnon, S. P. McAlister, C. Storey, J. S. Hamel, and P. Ashburn, “Hot carrier stressing of NPN polysil- icon emitter bipolar transistors incorporating fluorine”, IEEE Trans. Electron Dev., vol. 50, no. 4, pp. 1141–1144, 2003.
  • [21] M. N. Kham, H. A. W. El Mubarek, J. M. Bonar, and P. Ashburn, “Study of fluorine behaviour in silicon by selective point defect injection”, Appl. Phys. Lett., vol. 87, p. 11902, 2005.
Typ dokumentu
Bibliografia
Identyfikator YADDA
bwmeta1.element.baztech-article-BAT8-0008-0011
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