Elektrochemiczne osadzanie gradientowych powłok stopowych Ni-P

• Autorzy: Wiliński Z. , Lipińska L. , Rzepka A. , Batijewski R.

Warianty tytułu

EN

Electrochemical deposition of Ni-P alloy gradient coatings

• Języki publikacji: PL

Abstrakty

PL

W artykule przedstawiono wyniki badań mających na celu optymalizację warunków procesu nakładania powłok Ni-P z kąpieli o różnym składzie. Podstawowymi parametrami wpływającymi na przebieg procesu były: zawartość soli niklu, gęstość prądu katodowego, temperatura i pH kąpieli, mieszanie roztworu (500 obr/ min) lub brak mieszania oraz zawartość dodatków. Badano wpływ tych czynników na wydajność procesu elektroosadzania i jakość uzyskanych powłok. Wyselekcjonowane kąpiele wykorzystano do nakładania gradientowych powłok Ni-P. Wykonano analizę chemiczną zawartości fosforu w powłokach oraz badania przyczepności, odporności korozyjnej, mikrotwardości i mikrostruktury otrzymanych powłok gradientowych.

EN

Electrodeposition of Ni-P coatings has important advantages: permits to control the plating speed and chemical composition of the deposit. Several electrolytes were investigated in order to optimize parameters of electrodeposition Ni-P alloy coatings (current density, temperature, electrolyte's pH, content of additives).The influence of these parameters on electrodeposition process efficiency and properties of obtained coatings were examined. Two electrolytes were selected for plating gradient (multilayer) coatings. The content of phosphor in Ni-P alloy was analytically evaluated. Also, the adherence, microhardness, microstructure and corrosion resistance of gradient coatings were investigated. All these parameters were the same or better than for coatings obtained during chemical deposition. After thermal treatment at 400° C the microhardness of gradient coatings increased to the level typical for chromium coatings. Ni-P gradient coatings can replace chromium finishing which is based on hazardous chemicals and has to be limited because of environment protection.

Słowa kluczowe

PL

powłoki Ni-P; osadzanie elektrochemiczne

EN

Ni-P alloy coatings; electrochemical deposition

• Wydawca: Sieć Badawcza Łukasiewicz - Instytut Technologii Materiałów Elektronicznych
• Czasopismo: Materiały Elektroniczne
• Rocznik: 2008
• Tom: T. 36, nr 3
• Strony: 47--62
• Opis fizyczny: Bibliogr. 24 poz., rys., wykr.

Twórcy

autor

Wiliński Z.

autor

Lipińska L.

autor

Rzepka A.

autor

Batijewski R.

• Instytut Technologii Materiałów Elektronicznych, ul. Wólczyńska 133, 01-919 Warszawa,

Bibliografia

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