Simple modeling approach for line impedance of on-chip CMOS interconnects

• Autorzy: Ymeri H. , Nauwelaers B. , Maex K.
• Języki publikacji: EN

Abstrakty

EN

Simple and accurate closed-form model enabling to calculate frequency-dependent distributed inductance and associated distributed series resistance per-unit-length of single on-chip interconnects on a lossy silicon substrate is presented. The closed-form formulas for the frequency-dependent series impedance parameters are obtained using a closed-form integration method and the vector magnetic potential equation. The proposed frequency-dependent inductance -L(omega) and resistance R(omega) per-unit-length formulas are shown to be in good agreement with the electromagnetic solutions.

Słowa kluczowe

EN

analytic formulas; on-chip interconnects; silicon substrate; eddy currents; CMOS integrated circuits; electric resistance; elemental semiconductors; integrated circuit interconnections; integrated circuit modelling; silicon; electromagnetic solution; semiconductor integrated circuits; inductance

PL

wzór analityczny; złącze na układach scalonych; modelowanie oporności liniowej; podkład krzemowy; prąd wirowy; układ scalony CMOS; opór elektryczny; półprzewodnik jednopierwiastkowy; krzem; przewodnictwo

• Wydawca: Instytut Podstawowych Problemów Techniki PAN
• Czasopismo: Journal of Technical Physics
• Rocznik: 2004
• Tom: Vol. 45, no 1
• Strony: 71--77
• Opis fizyczny: Bibliogr. 16 poz., rys., wykr.

Twórcy

autor

Ymeri H.

• Katholieke Universiteit Leuven Department of Electrical Engineering (ESAT) Div. ESAT-TELEMIC Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium

autor

Nauwelaers B.

• Katholieke Universiteit Leuven Department of Electrical Engineering (ESAT) Div. ESAT-TELEMIC Kasteelpark Arenberg 10, B-3001 Leuven-Heverlee, Belgium

autor

Maex K.

• The Interuniversity Microelectronics Center (IMEC) Kapeldreef 75, B-3001 Leuven, Belgium

Bibliografia

• 1. Y.I. ISMAIL, E.G. FRIEDMAN, Effects of inductance on the propagation delay and repeater insertion in VLSI circuits, IEEE Trans. Very Large Scale Integration (VLSI) Systems, 8, 195-206, April 2000.
• 2. Agilent, Tech. Rep., Agilent Eesof EDA, Santa Rosa, CA, 2002.
• 3. L. HE, K.M. LEPAK, Simultaneous shield insertion and net ordering for capacitive and inductive coupling minimization, Proceedings of the International Symposium on Physical Design, 55-60, 2000.
• 4. Semiconductor Industry Association, International Technology Roadmap for Semiconductors, 1999.
• 5. H. YMERI, B. NAUWELAERS, K. MAEX, Distributed inductance and resistance per-unit-length formulas for VLSI interconnects on silicon substrate, Microwave Opt. Technol. Lett., 30, 302-304, 2001.
• 6. J. ZHENG, Y.-C. HAHM, V. K. TRIPATHI, A. WEISSHAAR, CAD-oriented equivalent-circuit modeling of on-chip interconnects on lossy silicon substrate, IEEE Trans. Microwave Theory Tech., 48, 1443-1451, September 2000.
• 7. H. YMERI, B. NAUWELAERS, K. MAEX, New closed-form formula for mutual frequency-dependent resistance and inductance of 1C interconnects on silicon substrate, Journal of Micromechanics and Microengineering, 11, 283-286, May 2001.
• 8. H. HASEGAWA, M. FURUKAWA, H. YANAI, Properties of microstri,p line on Si-SiO2 system, IEEE Trans. Microwave Theory Tech., 19, 869-881, November 1971.
• 9. T. SHIBATA, E. SANO, Characterization of MIS structure coplanar transmission lines for investigation of signal propagation in integrated circuits, IEEE Trans. Microwave Theory Tech., 38, 881-890, July 1990.
• 10. J.P.K. GILB, C. BALANIS, MIS slow-wave structures over a wide range of parameters, IEEE Trans. Microwave Theory Tech., 40, 2148-2154, December 1992.
• 11. E. GROTELUSCHEN, L.S. DUTTA, S. ZAAGE, Full-wave analysis and analytical formulas for the line parameters of transmission lines on semiconductor substrates, Integration, The VLSI J., 16, 33-58, 1993.
• 12. J. ZHENG, V.K. TRIPATHI, A. WEISSHAAR, Characterization and modeling of multiple, coupled on-chip interconnects on silicon substrate, IEEE Trans. Microwave Theory Tech., 49, 1733-1739, October 2001.
• 13. J.A. TEGOPOULOS, E.E. KRIEZIS, Eddy currents in linear conducting media, Elsevier, Amsterdam 1985.
• 14. S. RAMO, J.R. WHINNERY, T. VAN DUZER, Fields and waves in communication electronics, Wiley, New York 1984.
• 15. E.D. SUNDE, Earth Conduction Effects in Transmission Systems, Dover, New York 1968.
• 16. G.A. KORN, T.M. KORN, Mathematical handbook for scientists and engineeres, McGraw-Hill, New York 1951.