Trends in assembling of advanced IC packages

• Autorzy: Kisiel R. , Szczepański Z.
• Języki publikacji: EN

Abstrakty

EN

In the paper, an overview of the current trends in the development of advanced IC packages will be presented. It will be shown how switching from peripheral packages (DIP, QFP) to array packages (BGA, CSP) and multichip packages (SiP, MCM) affects the assembly processes of IC and performance of electronic systems. The progress in bonding technologies for semiconductor packages will be presented too. The idea of wire bonding, flip chip and TAB assembly will be shown together with the boundaries imposed by materials and technology. The construction of SiP packages will be explained in more detail. The paper addresses also the latest solutions in MCM packages.

Słowa kluczowe

EN

IC packages; SiP; wire bonding; TAB; ip chip

• Wydawca: Instytut Łączności - Państwowy Instytut Badawczy
• Czasopismo: Journal of Telecommunications and Information Technology
• Rocznik: 2005
• Tom: nr 1
• Strony: 63--69
• Opis fizyczny: bibliogr. 34 poz., tab., il.

Twórcy

autor

Kisiel R.

• Institute of Micoelectronics and Optoelectronics, Warsaw University of Technology Koszykowa st 75, 00-662 Warsaw, Poland

autor

Szczepański Z.

• Institute of Micoelectronics and Optoelectronics, Warsaw University of Technology Koszykowa st 75, 00-662 Warsaw, Poland

Bibliografia

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