EMC shielding in power electronics multilayers

• Autorzy: Schuh S. , Albach M.
• Języki publikacji: EN

Abstrakty

EN

The integration of passive components in printed circuit boards by using structured layers of different material leads to completely new technical challenges, both in technological realisations and in simulations or modelling of the embedded components. The integration of uiductive components is very interesting due to the substantial place reduction on the surface of the printed circuit board. In this context the shielding of the stray field of these inductive components leads to some new approaches in magnetic field calculation and simulation by planar structures. So in this paper the influence of FPC foils (Ferrite Polymer Compounds), m-metal and thin layers of copper on the magnetic field distribution and thus on the inductive coupling mechanisms in multilayers is analytically calculated and verified by some measurements. The presented results - measurement and simulation - lead to the final conclusion that the integration ofi-metal in comparison to FPC foils and thin layers of copper in the multilayer is one of the promising procedures for EMC-shielding.

Słowa kluczowe

EN

power electronics; multilayer; planar passive component; analytical analysis

• Wydawca: AGH University of Science and Technology ; Lodz University of Technology
• Czasopismo: Electrical Power Quality and Utilisation. Journal
• Rocznik: 2005
• Tom: Vol. 11, nr 2
• Strony: 57--63
• Opis fizyczny: bibliogr. 8 poz.

Twórcy

autor

Schuh S.

• Friedrich-Alexander University of Erlangen-Nuremberg, Germany

autor

Albach M.

• Friedrich-Alexander University of Erlangen-Nuremberg, Germany

Bibliografia

• 1. Albach M. , Schuh S. I Analysis of embedded passives integrated circuits for power converters. Power Conversion Intelligent Motion Conference —- PCIM, Nuremberg, Germany, 2003.
• 2. Chen W., Yan Y., Hu Y.: Model and design of PCB winding parallel for planar transformers. IEEE International Magnetics Conference — TNTERMAG, Boston, USA, 2003.
• 3. Faucher S., Joubert C., Forest F., Wilmot F., Laboure E. , Costa F. I Passive Components Integration for Power Electronic. IEEE European Conference on Power Electronics and Applications — EPE, Leoben, Austria, 2001.
• 4. Schuh S . , Albach M. : Magnetic field distribution in embedded passive integrated circuits. IEEE European Conference on Power Electronics and Applications — EPE, Toulouse, France, 2003.
• 5. Schuh S., Albach M., Koch R.: Planar inductive components in the vicinity of conductive, permeable material. Power Conversion Intelligent Motion Conference — PCIM, Nuremberg, Germany, 2005.
• 6. Waffenschmidt E., Ackermann B. : Power converter with printed circuit board integrated passive components. IEEE European Conference on Power Electronics and Applications -EPE, Toulouse, France, 2003.
• 7. Waffenschmidt E., Ferreira J.A.: Embedded passives integrated circuits for power converters. IEEE Power Electronics Specialists Conference — PESC, Cairns Australia, 2002.
• 8. Waffenschmidt E., Ackermann B., Langkabel E., Wille M., Marczinske H., Schuh S.: Integral manufacturing of embedded passives integrated circuits for power electronics. Power Conversion Intelligent Motion Conference —PCIM, Nuremberg, Germany, 2004.