Wykorzystanie mikrostrumieni do intensyfikacji procesów wymiany ciepła

• Autorzy: Żukowski M.

Warianty tytułu

EN

Application of Micro Fluxes Used for Intensification of Heat Exchange

• Języki publikacji: PL

Abstrakty

PL

Przedstawiono przegląd literatury obejmujący prace badawcze związane z zastosowaniem strug cieczy uderzających w powierzchnie płaskie we wszelkiego typu wymiennikach ciepła. Zaprezentowane zostały zarówno wyniki najważniejszych eksperymentów jak i symulacji numerycznych. Przedstawiono również podstawowe zależności matematyczne charakteryzujące zjawisko wymiany ciepła zachodzące z rejonie kontaktu strumienia płynu z powierzchnią płaską. Na zakończenie autor pokrótce opisał własną koncepcję urządzenia wykorzystującego mikrostrumienie.

EN

A review of literature is presented covering the research concerning the use of liquid jets striking the flat surfaces in all types of heat exchangers. The main results of both - experiments and numerical simulations are given. The basic mathematical relationships characterizing the phenomenon of heat exchange occurring in the region of fluid flow contact with the flat surface are also shown. In conclusion, the author describes briefly his own concept of a device with application of micro fluxes.

Słowa kluczowe

PL

mikrostrumienie; wymiana ciepła

EN

micro fluxes; heat exchanges

• Wydawca: Wydawnictwo SIGMA-NOT
• Czasopismo: Ciepłownictwo, Ogrzewnictwo, Wentylacja
• Rocznik: 2011
• Tom: T. 42, nr 6
• Strony: 238--244
• Opis fizyczny: Bibliogr. 23 poz.

Twórcy

autor

Żukowski M.

• Katedra Ciepłownictwa, Politechnika Białostocka,

Bibliografia

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• [2] Fabbri M., Jiang S., Dhir V.K.: A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets. Transactions - American Society of Mechanical Engineers, Journal of Heat Transfer, 127 no. 1, 2005, pages 38^t8
• [3] Bhunia A., Boutros, K., Chen C-L.: High heat flux cooling solutions for thermal management of high power density gallium nitride HEMT. 9* Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM apos; 04. Volume 2, Issue, 2004, pages 75-81
• [4] Bhunia A., Cai Q., Chen C-L.: Jet Impingement Cooling of a 30/55-kWSemikron Inverter Module. Emerging two-phase cooling technologies for power electronic inverters. Interm report prepared by Oak Ridge National Laboratory, July 2005
• [5] Mikielewicz D., Pląta M., Mikielewicz J., Piwnik J.: A simple model ofa microjet for high-precision liquid cooling systems. 12th International Symposium Heat Transfer and Renewable Sources of Energy HTRSE - 2008, Szczecin - Międzyzdroje 2008
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• [7] Sung M.K., Mudawar I.: Experimental and numerical investigation of single-phase heat transfer using a hybrid jet-impingement/micro-channel cooling scheme. International Journal of Heat and Mass Transfer 49, 2006, pages 682-694
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• [13] Liu S. et al.: A microjet array cooling system for thermal management of active radars and high-brightness LEDs. Proceedings of 56* Electronic Components and Technology Conference, 30 May-2 June 2006, pages 1634-1638
• [14] Luo X., Liu S.: A Microjet Array Cooling System for Thermal Management of High-Brightness LEDs. IEEE Transactions on Advan-ced Packaging 30 (3), 2007, pages 475^84
• [15] Luo XB. et al.: Experimental and numerical study on a microjet cooling solution for high power LEDs. Science in China Series E: Technological Sciences 50 (4), 2007, pages 478-489
• [16] Liu S. et al.: Structural optimization ofa microjet based cooling system for high power LEDs. International Journal of Thermal Sciences 47, 2008, pages 1086-1095
• [17] Robinson A.J., Schnitzler E.: An experimental investigation of free and submerged miniaturę liquid jet array impingement heat transfer. Experimental Thermal and Fluid Science 32, 2007, pages 1-13
• [18] Wu S. et al.: Micro heat exchanger by using MEMS impinging jets. In: IEEE International Conference on Micro Electro Mechanical Systems, 12* MEMS'99. IEEE, Piscataway, NJ, 1999, pages 171-176
• [19] Shen C.H., Gau C: Heat Exchanger Fabrication with Arrays of Sensors and Heaters with Its Micro-Scale Impingement Cooling Process Analysis and Measurements. Sensors and Actuators A: Physical, Vo. 114, 2004, pages 154-162
• [20] Stefanescu S. et al.: Microjet array heat sink for power electronics. IEEE International Conference on Micro Electro Mechanical Systems, MEMS'99. 12th Volume, 17-21 Jan 1999, pages 165-170
• [21] Campbell S.J. Jr et al.: Thermal management of a laptop computer with synthetic airmicrojets. 6"1 Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM'98, 27-30 May 1998, pages 43-50
• [22] Kercher D.S. et al.: Microjet cooling devices for thermal management of electronics. IEEE Transactions on Components and Packaging Technologies, Volume 26, Issue 2, June 2003, pages 359-366
• [23] Wang E.N et al.: Micromachined Jets for Liquid Impingement Cooling of VLSI Chips. Journal of Microelectromechanical Systems 13 (5), 2004, pages 833-842