Comparative Study on the Electrical and Mechanical Characteristics of Ni-30wt%Co and Cu-2wt%Be Alloy for Development of Semiconductor Test Probe Pin

• Autorzy: Park Jin-Young , Kim Young-Choon , Kim Jae-Gyun

Identyfikatory

DOI

10.24425/amm.2019.129477

• Języki publikacji: EN

Abstrakty

EN

Ultra-precision testing is a very important procedure to secure the reliability of the products as well as for the technology development in the areas of semiconductor and display. Accordingly, companies manufacturing equipment for testing of semiconductor and display have been continuously executing researches for the improvement of the performances of test sockets used in test equipment. Through this study, characteristics of the materials in accordance with the mechanical and electrical properties of Ni-30wt%Co alloy and newly developed Cu-2wt%Be alloy were analyzed in order to select the probe pin material of the socket, which is a key component used in the semiconductor testing equipment. In addition, finite element interpretation was executed by using Ansys Workbench 14.0 to comparatively analyze the finite element interpretation results and experimental results. Experiment was executed for the mechanical properties including tensile strength, elasticity modulus, specific heat, thermal expansion coefficient and Contact Force, for electrical properties, experiment on surface resistance, specific resistance and electrical conductivity was executed to measure the properties. It was confirmed that the results of finite element interpretation and experiment displayed similar trend and it is deemed that the Contact Force value was superior for Be-Co alloy. Through this study, it was confirmed that the newly developed Be-Co alloy is more appropriate as probe pin material used as the core component of test socket used in the semiconductor testing equipment than the existing Ni-Co alloy.

Słowa kluczowe

EN

probe pin; Be-Cu Alloy; Ni-Co Alloy; test socket; mechanical properties; electrical properties

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2019
• Tom: Vol. 64, iss. 3
• Strony: 943--947
• Opis fizyczny: Bibliogr. 12 poz., rys., tab.

Twórcy

autor

Park Jin-Young

• Kongju National University, Graduate School, Department of Mechanical Engineering, Cheonan-si, Republic Korea

autor

Kim Young-Choon

• Kongju National University, Division of Mechanical & Automotive Engineering, Cheonan-si, Republic Korea

autor

Kim Jae-Gyun

• Kongju National University, Department of Mechanics Engineering, Cheonan-si, Republic Korea

Bibliografia

• [1] H. Kahn, N. Tayebi, R. Ballarini, R. L. Mullen, A. H Heuer, Fracture toughness of polysilicon MEMS devices, Sensors and Actuators 82, 274-280 (2000).
• [2] H. Yu, Y. Yang, Z. Cao, Hot Working technology, 2013, “Effects of Li Content on Microstructure and Mechanical Properties of Mg-Li-Al-Ce-Ca Alloy”.
• [3] D. H Anthony, A. P. Burnett, D. L. Smith, Shear test for measuring bonding in cast gold alloy-porcelain composites, J. Dent. Res. (1970).
• [4] T. Fukunaga and et al., Structural Characterization of Ni-V amorphous alloys prepared by mechanical alloying, Materials Science and Engineering A 134 (1991).
• [5] Susumu Arai, Morinobu Endo, Norio Kaneko, Ni-deposited multiwaalled carbon nanotubes by electrodeposition, J. of Carbon 42, 641-644 (2004).
• [6] Y. Nagasawa, S. Yarnashita, M. Matsudo, Probe needle, Tokyo Electron Yamanashi Kabushiki Kaisha 2, 1996.
• [7] Jang Yong Hoon, In Jeong Je, Yong S. Suh, Optimization of Thermal Deformation in Probe Card, Journal of the Korea Academia - Industrial cooperation Society 11, 11, 4121-4128 (2010).
• [8] Park Yoo Soon, Signal Transmission Characteristic Analysis and Measurement of Probe Pin, Kongju National University Department of Electrical and Electronic Control Engineering 02, 2017.
• [9] Hong Gu, S. Back, Nano-Materials for Probe Tip of SPM and Improvement of Surface Hardness (2008).
• [10] W. N. Sharpe, K. T. Turner, R. L. Edwards, Ensile testing of polysilicon, Experimental Mechanics 39 (1999).
• [11] Hsien-Chiao Teng, Study of Contact Degradation in Final Testing for BGA, 2007.
• [12] Hak-jun Kim, Jin-keon Yu, Jongmin Kim, Jung-bea Oh, Hyung-do Lim, WansooNah, Prediction of Signal Transfer Characteristics of Probe Card Using Electro-Magnetic Solvers, The 8th International Symposium on Antennas, Propagation and EM Theory(ISAPE), IEEE, pp 1229-1232, November 2-5, 2008.

Uwagi

EN

1. The work was supported by the research grant of the Kongju National University in 2017.

PL

2. Opracowanie rekordu w ramach umowy 509/P-DUN/2018 ze środków MNiSW przeznaczonych na działalność upowszechniającą naukę (2019).