Studies on Cementation of Tin on Copper and Tin Stripping from Copper Substrate

• Autorzy: Rudnik E. , Sikora P.

Identyfikatory

DOI

10.1515/amm-2016-0101

• Języki publikacji: EN

Abstrakty

EN

Cementation of tin on copper in acid chloride-thiourea solutions leads to the formation of porous layers with a thickness dependent on the immersion time. The process occurs via Sn(II)-Cu(I) mechanism. Chemical stripping of tin was carried out in alkaline and acid solutions in the presence of oxidizing agents. It resulted in the dissolution of metallic tin, but refractory Cu3Sn phase remained on the copper surface. Electrochemical tin stripping allows complete tin removal from the copper substrate, but porosity and complex phase composition of the tin coating do not allow monitoring the process in unambiguous way.

Słowa kluczowe

EN

tin; copper; cementation; stripping

• Wydawca: Institute of Metallurgy and Materials Science of Polish Academy of Sciences ; Committee of Materials Engineering and Metallurgy of Polish Academy of Sciences
• Czasopismo: Archives of Metallurgy and Materials
• Rocznik: 2016
• Tom: Vol. 61, iss. 2A
• Strony: 593--598
• Opis fizyczny: Bibliogr. 17 poz., rys.

Twórcy

autor

Rudnik E.

• AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Department of Physical Chemistry and Metallurgy of Non-Ferrous Metals, Al. Mickiewicza 30; 30-059 Cracow, Poland

autor

Sikora P.

• AGH University of Science and Technology, Faculty of Non-Ferrous Metals, Department of Physical Chemistry and Metallurgy of Non-Ferrous Metals, Al. Mickiewicza 30; 30-059 Cracow, Poland

Bibliografia

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